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January 2017

Rogers to Exhibit its Advanced Circuit and Thermal Management Materials at DesignCon


Rogers Corporation Advanced Connectivity Solutions (ACS) will feature examples of its high-performance circuit and thermal management materials for the most demanding electronic designs and working environments at DesignCon 2017, January 31-February 2, 2017 (exhibition from February 1-2, 2017) in the Santa Clara Convention Center (Santa Clara, Calif.). DesignCon is a premiere event for electronic design engineers working on circuit and system levels. 

 

Representatives from Rogers’ ACS will be available at Booth #421 to offer insight and advice on the optimum use of their materials, including the 92ML™ Series, COOLSPAN® TECA, RO3003™ and CLTE-XT™ materials. The 92ML materials, for example, can help meet some of the most challenging thermal management issues. With a glass transition temperature (Tg) of +160°C and high thermal conductivity of 2.0 W/m·K, 92ML materials can be supplied with copper cladding up to 4 oz. thickness, to handle the most demanding heat-transfer requirements in power supplies and automotive electronics.

 

When even greater cooling capability is needed, 92ML StaCoolÔ laminates are available with an insulated metal substrate (IMS). The IMS heatsink can be machined to a customer’s requirements, serving as part of the mechanical design in the final application. 

 

Rogers’ thermal-management materials also include COOLSPAN TECA adhesive film for bonding heatsinks to circuit materials with reliable thermal interfaces. This lead-free-process-compatible thermoset, epoxy-based, silver-filled adhesive film features outstanding thermal conductivity of 6 W/m·K to ensure thermally stable bonds between heatsinks and PCB materials. COOLSPAN TECA represents a practical alternative to fusion bonding, sweat soldering, press-fit, and other methods for attaching circuits to heatsinks and other mechanical structures. 

 

RO3003™ 5 mil thick laminates are ideal for loss-critical millimeter wave frequency designs, where consistent circuit performance matters, such as automotive radar sensors and point-to-point microwave backhaul-communications systems.

 

While already a benchmark for 77 GHz automotive radar sensors, RO3003 3.0 dielectric constant (Dk) laminates are available with 1/2-ounce and 1-ounce rolled copper foil. Combining the very low dielectric loss of the RO3003 PTFE-ceramic resin system with smooth foil results in high frequency circuit materials with best-in-class insertion loss. 

 

Rogers CLTE-XT laminates combine ceramic and PTFE materials to achieve excellent electrical and mechanical stability for a wide range of applications, from amplifiers to passive components. These materials are characterized by low coefficient of thermal expansion (CTE) in all three axes and stable Dk with temperature. They are well suited for phase-sensitive circuits, including in microwave feed networks and in satellite-communications (satcom) systems.  

 

Visitors to DesignCon 2017 and the Rogers booth #421 can learn more about these and many other advanced material solutions from Rogers Corp. and how to best apply them to their particular circuit and systems designs. The materials have demonstrated outstanding reliability in some of the most challenging environments, including the thermal extremes of a growing number of automotive electronic applications. 

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