coolingzone 2015 is proud to announce that dr. y.c. lee, ph.d., of university of colorado, boulder, co, will be speaking on lexible thermal ground planes for smartphones and wearable electronics.  "the thermal ground plane is at least three times as efficient as graphite and ten times as efficient as copper. another important advantage of the cu technology licensed by kelvin thermal is its ultra-thin profile, taking up less space in smartphones and other small systems" lee said. in addition, the device is flexible, a necessity for the development of flexible smartphones and wearable devices.

coolingzone 2015 thermal management summit, a live webcast, is being held october 20-22, 2015.  for more information and to register for coolingzone please visit the coolingzone 2015 summit page.

for more information on the thermal ground plane, see coolingzone's coverage of this topic on our website here.