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multi-chip modules (mcms) look like single chip components, but as the name describes, they actually contain multiple chips in one package. one example of an mcm is intel’s core i7 cpu series. these are still called cpus, but they are actually modules that house the cpu itself, along with other components such as the memory controller and graphics processor.

the advantages of mcm construction are many, including reduced size vs discrete components, faster data rates and better signal quality (with less emi) between the components on an mcm, and simpler motherboard design, since many connections are now made within the mcm.  mcms do create challenges for thermal engineers however, not only because of the possible increase in power density, but because the traditional jedec jesd51 standard only holds true when the junction-to-case thermal resistance, ?j-c, describes the thermal path from one heat source to the case (or other reference point). 

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