Press Releases

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  Thermal Interface Material Is First to Feature Low Stress, 1.0 W per m K Thermal Conductivity and EMI Absorbtion for Frquencies Above 1GHz

  Henkel today announced that it has developed the market's first-ever extremely low stress thermal interface material that unites thermal conductivity with EMI absorption capabilities. The latest in its line of BERGQUIST GAP PAD products, Henkel's GAP PAD EMI 1.0 offers electronic specialists critical heat and electromagnetic energy control in a flexible, gap filling product designed to exhibit... details>>
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  Fujipoly Sarcon GR-ae Series is a Silicone Thermal Interface Material for Cooling LED

  Cost-effective silicone based material is available in nine thicknesses that deliver a thermal conductivity of 1.3 W/m K with a thermal resistance as low as 0.50 degree C cm2/W. Sarcon� GR-ae is available in pre-cut sheets up to 200mm x 300mm or can be die-cut to fit the exact application specifications. details>>
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  Panasonic Highlights Ultra-Thin, Lightweight, Graphite Film With Thermal Conductivity 700 to 1750 W/(m-K) [video]

  Panasonic's Pyrolitic Graphite Sheet (PGS) has a themal conductivity four times greater than copper, is extremely pliable and can be applied to CPU's., Amplifiers, DSP's and more. The graphite material is Lightweight: specific gravity of 0.85 to 2.1 g/cm3. It can be easily cut and formed for a wide variety of applications. details>>
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  Fujitsus New Liquid Cooling for PRIMERGY Servers Halves Cooling Costs

  Fujitsu extends its high performing, reliable and energy efficient server solutions for large scale out environments including High Performance Computing (HPC), with the introduction of the award winning Cool-Central Liquid Cooling Solution that reduces cooling costs by up to 50 percent. In a world of rising energy costs and higher rack densities, Fujitsus new solution enables data center... details>>
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  Aavid Thermalloy Releases Heat Pipe Exploration and Discovery Kit

  Aavids Heat Pipe Exploration and Discovery Kits are designed for engineers experiment with heat pipes to get a feel for how they work, what they do, and try them in various electronics cooling applications. The new Discovery kit is a smaller version of Aavid's popular exploration kit and is appropriate for a small team working on a few projects. The larger exploration kit can be used by larger... details>>
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  TECA Releases New PWM Temperature Controller for AHP-1200CPV Cold/Hot Plate

  TECA has released a new PWM Temperature Controller for AHP-1200CPV Cold/Hot Plate. The new temperature controller is a Pulse Width Modulating (PWM) controller. It includes fan speed control which enables AHP-1200CPV / AHP-1200CAS to slow the fan automatically, reducing noise, as the unit reaches its set point. Another added benefit is that there are now four independent PID settings for... details>>
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  ACT Receives Lockheed Martin Contract To Support Missile Development

  Advanced Cooling Technologies, Inc. has announced that it has been awarded a contract from Lockheed Martin to help develop, test and ultimately field the Long Range Anti-Ship Missile, LRASM, a joint program of the Defense Advanced Research Projects Agency, DARPA, the U.S. Navy and the U.S. Air Force. LRASM is designed to feature a variety of highly sophisticated technologies that will allow it to... details>>
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  Pentair acquires Pigeon Point Systems to expand its Schroff product portfolio for monitoring systems including shelf thermal management

  Pentair announces the acquisition of Pigeon Point Systems, a producer of management components, focusing on open modular platforms as AdvancedTCA, MicroTCA, CompactPCI and VPX. By combining Pigeon Point Systems products with Pentair's broad range of Schroff products. Pigeon Point Systems management components provide exception thermal management control of open systems. details>>
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  PowerAmerica and Lockheed Martin Partner to Accelerate the Development of Energy Efficient Electronics

  PowerAmerica, the Next Generation Power Electronics Manufacturing Innovation Institute, and Lockheed Martin are partnering to develop a new generation of power-efficient microelectronic devices that will reduce energy loss across the power grid and enhance the performance of future aerospace systems. details>>
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  Iceotope Announces Total Liquid Cooled Mellanox-Based Switches

  Liquid cooling company, Iceotope, has today announced that it has developed the first fan-less Mellanox-based InfiniBand and Ethernet high-performance network and interconnect switch for HPC (High Performance Computing). Combined with Iceotope's technology, Mellanox's high-performance, low latency switches can now be cooled with hot water (of up to 45C), enabling chiller-less operation in all... details>>