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Editorial

  • Blog / Editorial Article Test

    Praesent ac justo quam. Proin in lectus in neque ultricies pretium. Suspendisse vestibulum turpis eget sollicitudin luctus. Curabitur at dignissim velit. Nunc vitae magna turpis. Nunc quis urna finibus tellus aliquet scelerisque. Sed ut massa finibus, aliquet nulla non, consectetur purus. Suspendisse id felis urna. Praesent at pharetra dui. Maecenas nibh metus, rhoncus eget scelerisque vitae,... details>>
  • How Liquid Cooling Works [VIDEO]

    Asetek liquid cooling systems have three basic elements: a very efficient integrated pump, reservoir and cold plate unit; a heat exchanger (radiator) and finally, connecting tubes to transport the liquid. details>>
  • Microfluidics: DARPA is betting embedded water droplets could cool next-gen chips

    Hot spots are an increasing problem in microprocessor design for two reasons: First, transistor density has continued to increase over the past decade, even as clock speeds have flatlined. This means more and more transistors are packed into a smaller space, which means each transistor has less and less area to dissipate heat. The second problem is that CPU voltage largely stopped scaling. details>>
  • Light Could Become the Dominant Form of Heat Transfer

    When objects get close without touching, heat can be transferred from one to the other in the form of light. details>>
  • coolingZONE 2015 Webinars Start October 20th! Don\'t Miss Out!

    Industry leading webinars on thermal management start October 20th! Don't miss out on industry leading engineers sharing their knowledge on liquid cooling, heat pipe selection, choosing the right thermosyphon, Predictive data center cooling and much more. details>>
  • New Study Sheds Light On Cooling Capacity Of Phase Change Materials

    Dr. Patrick Shamberger, assistant professor in the Department of Materials Science and Engineering at Texas A&M University, has found an analytical solution to heat transfer in PCMs used in thermal energy storage and has identified the relative role of thermo-physical properties of different materials in his article, "Cooling Capacity of Figure of Merit for Phase Change Materials," which was... details>>
  • Dr. Y.C. Lee, Ph.D. To Speak at coolingZONE-15 on Flexible Thermal Ground Planes for Smartphones and Wearable Electronics.

    coolingZONE 2015 is proud to announce that Dr. Y.C. Lee, Ph.D., of University of Colorado, Boulder, CO, will be speaking on flexible Thermal Ground Planes for Smartphones and Wearable Electronics. The thermal ground plane is at least three times as efficient as graphite and ten times as efficient as copper. Another important advantage of the CU technology licensed by Kelvin Thermal is its... details>>
  • Our 15th Year! coolingZONE 2015 Thermal Management Summit

    coolingZONE 2015 Thermal Management Summit is now in its 15th year! This year should be very exciting and we look forward to offering some of the industries best presenters on data center cooling, full immersion looking, predictive data center cooling and much more. details>>
  • Cost Reducing Graphite for Thermal Management The Focus of Canadian Univeristy and Commercial Partnership

    Graphite's promise for widespread use in thermal management has been hampered at some level due to the cost. A team from Canada is now addressing that to reduce the overall cost. Simone Fraser University, Sheridan College, Terella Energy Systems, Alpha Technologies and Westport Innovations have teamed up to address this, funded by The Natural Sciences and Engineering Research Council's... details>>
  • LSU Team Discovers Another Material Breakthrough For Electronics Cooling

    Refrigeration and air conditioning may become more efficient and environmentally friendly thanks to the patent-pending work of LSU physicists. The team of researchers led by LSU Physics Professor Shane Stadler has discovered a breakthrough magnetocaloric material that may change the energy industry, including air conditioning and food refrigeration. ?The world refrigeration market is expected to... details>>
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