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• Graphene quilts for thermal management of GaN transistors

  Thermal management of GaN transistors can be substantially improved via introduction of alternative heat-escaping channels implemented with few-layer graphene?an excellent heat conductor. details>>

• Industry Developments: Smartphone Cooling Systems

  Powerful computing systems use water cooling to keep their CPUs from overheating. Now, smaller versions of these cooling systems are being employed in warm smartphones. details>>

• Thermal Performance of Thin Flat Heat Pipes

  A review of thin heat pipe designs and thermal performance from Qpedia. Thermal performance varies depending on their design, material used, wick structure and working fluid chosen. details>>

• New Design Concepts in 3D Stacked Chips and Their Thermal Challenges

  The new generation of stacked packages called fan in package on package (FiPOP) addresses the limitation posed by POP of increased size and thickness details>>

• Technology Review: Mobile Device Thermal Management

  Qpedia continues its review of technologies developed for electronics cooling applications. In this issue our spotlight is on cooling applications for mobile devices.rn details>>

• iPhone 7 Week Begins on coolingZONE

  In celebration of the iPhone 7 hitting the market, coolingZONE will be spending this week discussing how thermal engineers have managed to keep the "hottest" mobile products "cool" for everyone to enjoy. details>>

• The Large Scale Synthesis of Aligned Plate Nanostructures

  A novel technique for the large-scale synthesis of aligned-plate nanostructures that are self-assembled and self-supporting. The synthesis technique involves developing nanoscale two-phase microstructures through discontinuous precipitation followed by selective etching to remove one of the phases. details>>

• Increasing the Lifespan and Reliability of Electrical Components

  Reducing the operating temperatures within electrical enclosures is an effective way to increase life expectancy and system reliability. If an enclosure is properly cooled, the cost associated with that cooling can be recovered over the life of the equipment. details>>

• Breaking Down Thermal Management Challenges in Forced Convection Tablets

  Accommodating higher performance computing in small form-factors such as a tablet is a thermal management challenge. Cooling by natural convection alone isn?t enough for the higher power density of a high-performance tablet, instead forced convection has to be used. details>>

• Thermal Management Market to Reach $20 Billion in Next Decade

  According to a report by Grand View Research, Inc., which was published on Yahoo Finance and other outlets, the global thermal management technologies market is expected to reach $20.14 billion (USD) by 2024. details>>