Log In   |   Sign up

New User Registration

Article / Abstract Submission
Register here
Register
Press Release Submission
Register here
Register
coolingZONE Supplier
Register here
Register

Existing User


            Forgot your password
August 2005

Dow Corning Attendance at Semi-Therm


dow corning recently hosted a booth and workshop at semi-therm, where we introduced dow corningто tc-5022, a new thermally conductive grease that offers a step-change in thermal performance and cost of ownership for high-end microprocessor packages. this is the latest material to emerge from our broad family of thermal interface materials, which includes a growing line of conductive greases such as dow corningто tc-5021 thermally conductive compound.

if you missed our workshop, we invite you to contact us for a copy of this presentation.

sincerely,

zuchen lin
dow corning conductive development manager

Choose category and click GO to search for thermal solutions

 
 

Subscribe to Qpedia

a subscription to qpedia monthly thermal magazine from the media partner advanced thermal solutions, inc. (ats)  will give you the most comprehensive and up-to-date source of information about the thermal management of electronics

subscribe

Submit Article

if you have a technical article, and would like it to be published on coolingzone
please send your article in word format to articles@coolingzone.com or upload it here

Subscribe to coolingZONE

Submit Press Release

if you have a press release and would like it to be published on coolingzone please upload your pr  here

Member Login

Supplier's Directory

Search coolingZONE's Supplier Directory
GO
become a coolingzone supplier

list your company in the coolingzone supplier directory

suppliers log in

Media Partner, Qpedia

qpedia_158_120






Heat Transfer Calculators