Log In   |   Sign up

New User Registration

Article / Abstract Submission
Register here
Press Release Submission
Register here
coolingZONE Supplier
Register here

Existing User

            Forgot your password
March 2018

NEO Tech Releases New LTCC and AlN Design Guidelines

neo tech, a leading provider of manufacturing technology and supply chain solutions for brand name oems in the industrial, medical and aerospace and defense markets, announces that it recently produced and published new and expanded guidelines for the manufacture of low-temperature co-fired ceramic (ltcc) and aluminum nitride (aln) packaging solutions.


neo tech has emerged as north america's leading manufacturer of high-reliability ltcc and high-temperature co-fired (htcc) substrates and packages. these fabrication technologies provide unique solutions for high interconnect density, compact packages and high-frequency applications. 


key advantages include:


  • embedded passive components
  • high density interconnect
  • cost-competitive plated silver systems
  • tce closely matches that of si, gaas and sic (and other associated compounds)
  • brazed on components (connectors, seal ring, heat spreaders)
  • hermetic packaging
  • outstanding long-term reliability


the guidelines include comprehensive information that highlight capabilities, overview and standard design considerations, which include conductors, vias, cavities, special high-frequency design provisions, capacitors, inductors, post-fired conductors, soldering, material thermal properties, and electrical and mechanical properties of ltcc.


neo tech's experience in ceramics processing has resulted in the development of the world's most reliable multilayer ceramics technology available to the microelectronics industry.


to learn more about how neo tech can assist with advanced packaging applications using ceramic substrates, or to download design guides, visit www.neotech.com.

Choose category and click GO to search for thermal solutions


Subscribe to Qpedia

a subscription to qpedia monthly thermal magazine from the media partner advanced thermal solutions, inc. (ats)  will give you the most comprehensive and up-to-date source of information about the thermal management of electronics


Submit Article

if you have a technical article, and would like it to be published on coolingzone
please send your article in word format to articles@coolingzone.com or upload it here

Subscribe to coolingZONE

Submit Press Release

if you have a press release and would like it to be published on coolingzone please upload your pr  here

Member Login

Supplier's Directory

Search coolingZONE's Supplier Directory
become a coolingzone supplier

list your company in the coolingzone supplier directory

suppliers log in

Media Partner, Qpedia


Heat Transfer Calculators