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October 2018

Indium to Feature Thermal Interface Materials at Thermal Management Workshop


Indium Corporation will feature its metallic thermal interface materials (TIMs) at the Advanced Technology Workshop on Thermal Management, November 6-8 in Los Gatos, California.

 

Indium Corporation’s metallic TIMs are easy to handle and rework.  These products provide higher thermal conductivity as compared to polymer-based TIMs, making them ideal for die-attach, burn-in and test, IGBT applications, and almost any application where high performance thermal materials are required.

 

Metallic TIMs can be used as either a solder or compressible material:

 

  • Solder TIMs, such as Solder Preforms, reflow and melt to form a mechanical bond
  • Compressible TIMs, such as Heat-Spring® or non-reflow metals, like Liquid Metal, do not require heat and support temperature-sensitive applications

 

Indium Corporation’s metallic TIMs can be custom-made to your specifications with a variety of materials based on your product or process needs and include Pb-free options.

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