Log In   |   Sign up

New User Registration

Article / Abstract Submission
Register here
Register
Press Release Submission
Register here
Register
coolingZONE Supplier
Register here
Register

Existing User


            Forgot your password
April 2019

Toyochem Showcases Heat-dissipating Technology for Power Devices at APEC 2019


Toyochem Co., Ltd., a member of the Toyo Ink Group, exhibited its latest power management technologies at the Applied Power Electronics Conference and Exposition 2019 (APEC 2019), a global event for applied power electronics.

 

Efficient thermal management is critical for the reliable performance of high power electronics, especially those found in automotive applications. To address industry needs for greater heat-dissipating properties, Toyochem showcased the LIOELM™ FTS series of thermally conductive adhesive sheets for bonding substrates to the heat sink, or as an insulating layer in power device packaging.

 

The LIOELM FTS sheet was developed by using Toyochem's advanced heat-resistant resins, resulting in a highly heat-conductive product with excellent flexibility and reliable heat-dissipating properties. Toyochem researchers in Japan were able to solve the performance trade-off problem between the elastic modulus and thermal resistance that typically arises in conventional epoxy-based thermal interface materials.

 

Thanks to its soft consistency (ultra-low modulus) and special rheology, the LIOELM FTS fills in every void and conforms to every rough surface, thus creating a high strength interface between power device components or substrates.

 

This results in optimum heat transfer and reduced thermal stress, making it possible to reach the low levels of thermal resistance necessary to transfer or insulate heat effectively.

 

“At the moment, the new adhesive sheets are undergoing trials in various LED light modules and other power devices, mainly with automotive makers in Japan and abroad,” reported stated Masashi Arishima, General Manager of Toyochem's New Material & System Business Department.

 

“The initial feedback has been very positive, and we are now looking to secure a stronger foothold in the US and Europe where demand from the auto sector, in particular for hybrid and electric vehicles, is expected to support growth of the power electronics market. With the new LIOELM series, we see an exciting opportunity to drive the market forward.”

 

Also on display at the Toyochem booth was the LIOMETAL™ SB series of nano-silver pastes for high heat-resistant and pressure-less sintering of a semiconductor chip to a circuit board. The company's original nanoparticle design allows LIOMETAL pastes to create uniform layers of sintered silver that exhibit both excellent durability and adhesion under high temperatures.

Choose category and click GO to search for thermal solutions

 
 

Subscribe to Qpedia

a subscription to qpedia monthly thermal magazine from the media partner advanced thermal solutions, inc. (ats)  will give you the most comprehensive and up-to-date source of information about the thermal management of electronics

subscribe

Submit Article

if you have a technical article, and would like it to be published on coolingzone
please send your article in word format to articles@coolingzone.com or upload it here

Subscribe to coolingZONE

Submit Press Release

if you have a press release and would like it to be published on coolingzone please upload your pr  here

Member Login

Supplier's Directory

Search coolingZONE's Supplier Directory
GO
become a coolingzone supplier

list your company in the coolingzone supplier directory

suppliers log in

Media Partner, Qpedia

qpedia_158_120






Heat Transfer Calculators