lord corporation has announced the availability of a new flame retardant urethane encapsulant for the electronic materials industry.

specially designed for encapsulating and casting applications, lord thermoset ur-288 encapsulant cures at room temperature to produce a flame-retardant, semi-flexible material. this new urethane encapsulant exhibits low shrinkage and stress on components as it cures, and maintains a low viscosity for complete and void-free encapsulation. suitable for curing at room temperature, thermoset ur-288 produces low exothermic heat rise during cure. further, it provides excellent thermal shock resistance.

according to jim grieg, sales and marketing manager, electronic materials, thermoset ur-288 was designed in response to increasing market demand for flame-retardant urethane materials.

more information on lord thermoset ur-288 can be found at http://www.lord.com/electronicmaterials. additional information can be obtained by contacting lord corporation by email at [email protected] or by phone at +1 877 ask lord (275 5673).