By Josh Perry, Editor
Semiconductor Research Corp. (SRC) has chosen researchers from Binghamton (N.Y.) University and Purdue University (West Lafayette, Ind.) to staff the new, multimillion-dollar Center for Heterogeneous Integration Research in Packaging (CHIRP), which will be dedicated to defining the future of electronics packaging.
CHIRP will further the research into electronics packaging for the next generation of products. (Wikimedia Commons)
According to a report from Binghamton, Ganesh Subbarayan, a professor of mechanical engineering at Purdue, and Bahgat Sammakia, vice-president for research and a professor of mechanical engineering at Binghamton, will be co-directors of the center.
CHIRP will “address issues in global interconnects, efficient power delivery, system design, thermal management, novel materials, reliability, and other topics,” according to the article. “Heterogeneous integration of many microchips into single packages will be essential to technology ranging from cell phones to mainframe computers for at least the next decade.”
“For more than 50 years, transistor scaling has enabled advancements in computing, mobile devices, automotive and medical electronics, while reducing the cost per transistor,” Subbarayan said in the report. “However, as we approach the limits of Moore’s Law promise of doubling transistor performance and energy efficiency by shrinking feature size, we must look in new directions for continued gains.”
A dozen faculty members from each school will participate in the center. SRC will provide $1.8 million for the first four years and another $1.8 million will come from the campuses, the State University of New York and others.
The founding members of CHIRP, which will guide the research, are ARM, IBM, Intel, NXP, Texas Instruments and Samsung.