Log In   |   Sign up

New User Registration

Article / Abstract Submission
Register here
Register
Press Release Submission
Register here
Register
coolingZONE Supplier
Register here
Register

Existing User


            Forgot your password
John O | February 2019

New research center dedicated to building the future of electronics packaging in the U.S.


By Josh Perry, Editor
jperry@coolingzone.com

 

Semiconductor Research Corp. (SRC) has chosen researchers from Binghamton (N.Y.) University and Purdue University (West Lafayette, Ind.) to staff the new, multimillion-dollar Center for Heterogeneous Integration Research in Packaging (CHIRP), which will be dedicated to defining the future of electronics packaging.

 


CHIRP will further the research into electronics packaging for the next generation of products. (Wikimedia Commons)

 

According to a report from Binghamton, Ganesh Subbarayan, a professor of mechanical engineering at Purdue, and Bahgat Sammakia, vice-president for research and a professor of mechanical engineering at Binghamton, will be co-directors of the center.

 

CHIRP will “address issues in global interconnects, efficient power delivery, system design, thermal management, novel materials, reliability, and other topics,” according to the article. “Heterogeneous integration of many microchips into single packages will be essential to technology ranging from cell phones to mainframe computers for at least the next decade.”

 

“For more than 50 years, transistor scaling has enabled advancements in computing, mobile devices, automotive and medical electronics, while reducing the cost per transistor,” Subbarayan said in the report. “However, as we approach the limits of Moore’s Law promise of doubling transistor performance and energy efficiency by shrinking feature size, we must look in new directions for continued gains.”

 

A dozen faculty members from each school will participate in the center. SRC will provide $1.8 million for the first four years and another $1.8 million will come from the campuses, the State University of New York and others.

 

The founding members of CHIRP, which will guide the research, are ARM, IBM, Intel, NXP, Texas Instruments and Samsung.

Choose category and click GO to search for thermal solutions

 
 

Subscribe to Qpedia

a subscription to qpedia monthly thermal magazine from the media partner advanced thermal solutions, inc. (ats)  will give you the most comprehensive and up-to-date source of information about the thermal management of electronics

subscribe

Submit Article

if you have a technical article, and would like it to be published on coolingzone
please send your article in word format to articles@coolingzone.com or upload it here

Subscribe to coolingZONE

Submit Press Release

if you have a press release and would like it to be published on coolingzone please upload your pr  here

Member Login

Supplier's Directory

Search coolingZONE's Supplier Directory
GO
become a coolingzone supplier

list your company in the coolingzone supplier directory

suppliers log in

Media Partner, Qpedia

qpedia_158_120






Heat Transfer Calculators