By Josh Perry, Editor
[email protected]

A recent article from Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering company based in Norwood, Mass., detailed recent research into heat exchanger technology and the ways that it is being implemented in electronics cooling applications.

Heat Exchangers are a common component in liquid cooling solutions for electronics. (Advanced Thermal Solutions, Inc.)

Among the concepts that were described in the article include a novel 3-D heat exchanger for power electronics, a microchannel heat exchanger, and a paper on analyzing the thermal performance of a heat exchanger for power electronic devices with high power density.

The abstract of that latter research stated:

“Liquid cooling system has been used in high power electronic device systems to cool down the temperature of power electronic device. Heat exchanger is an important part of liquid cooling system to transfer the heat generated by power electronic device into air.

“In this paper, a Streamline-upwind/Petrov-Galerkin (SUPG) stabilized finite element analysis method was proposed to solve the water and air governing formulas including the mass conservation equation, the momentum conservation and the energy conservation equation.

“Furthermore, the thermal characteristic of a heat exchanger is simulated, and the result was compared with an experiment. The comparison shows that this method is effective.”

ATS also posted a video about “What is a Heat Exchanger?” Watch the video below: