keynote lecture:

emerging thermal management technologies for future high performance multi-functional microsystems

next generation microsystems will incorporate unprecedented convergence of performance features, in ever-smaller form factors. their realization will require the concerted efforts of the thermal management community to handle the high heat fluxes and volumetric heat generation rates near the chips, along with the ultimate heat rejection to the environment. innovative chip architectures are resulting in localized hot spots, which require the development of on-demand, locally addressable cooling techniques. energy consumption by cooling devices is becoming a key concern in this era of skyrocketing energy costs and emphasis on sustainability. this talk will start with the identification of the thermal management challenges across the microsystem packaging hierarchy, from chip to the data center level. the role of newly developed technologies within the past decade, such as microfabricated cooling devices, nano-structured materials, and energy harvesting in meeting these challenges will be explored. as examples of new thermal management technology development, single phase liquid cooling and two-phase fluidic loops for chip or package level cooling will be described. while laboratory scale demonstrations of these devices have shown considerable promise, challenges facing broader adoption of such new technologies will be discussed.