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July 2013

T-Global Technology Announces New Thermally Conductive Liquid Gap Filling Material


t-global technologies has released their latest thermal interface material, the tg4040-2k thermally conductive liquid gap filling matierial.  the product is supplied as two components which can be cured at room temperature or at an elevated temperature to give excellent thermal and mechanical performance.

tg4040-2k offers an excellent solution for the thermal management of fragile components or those where surface topography would prevent the use of conventional materials.  upon curing, the material offers excellent thermal performance and also reduces stresses due to cte mismatches.

 

applications include automotive electronics, fibre optic telecommunications equipment, and consumer electronics.

 

for more information, please visit the t-global technologies web site or download their datasheet here

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