avionic and defense electronic systems are continuing to add functionality and features resulting in thermal design engineers being tasked to devise efficient thermal management approaches with minimum weight, volume, and cost. while adding the latest high performance devices often increases dissipated heat loads, the ambient environment is still at the mercy of nature. difficulties in thermal management cause constraints on system performance, especially in harsh environments. continuing research in innovative thermal solutions is easily justified by the need to reduce system operating temperatures.

challenges faced by the thermal design community in the avionics and defense industry are mostly familiar to their commercial counterparts. designing packaging for the latest high performance semiconductor is similar to the task performed in the commercial sector but complicated by requirements demanded by the avionics and defense electronics sector. these requirements include harsh environmental temperature extremes, dirty and humid air, and long operating life. this presentation will review current thermal design considerations for avionics and defense electronics and describe some of the specific concerns that must be addressed. the time required for new thermal management technology to be designed into avionics and defense electronics can be extensive. some of the reasons why this process is lengthy will be discussed.