Future Facilities Announces Next Generation of Electronic Cooling Software
future
facilities announces next generation of electronic cooling software
(july 13, 2009) - future
facilities has announced 6sigmaet, the next generation of electronic cooling
software and the first major product for electronics thermal analysis developed
in the last decade. “6sigmaet was developed by some of the industry’s
leading software designers with many years experience of the application of cfd
to electronics cooling. they were given the opportunity to start from scratch
without the restrictions involved in working with software that was developed
originally a decade ago,” said
sherman ikemoto, north american general manager of future facilities. “the
result is that 6sigmaet provides capabilities unmatched by previous-generation
products such as building the model entirely from intelligent objects which
speeds up model creation, enables automatic gridding and simplifies
post-processing.
“another
key advantage of 6sigmaet is support for the recent trend of redefining the form
factor of electronic products by erasing the traditional boundaries between the
box, rack and room. with 6sigmaet for example, pcb level design can be done in
the context of the data center as the final application. this opens the door to
a whole new range of products such as rack-based systems, containerized or
custom data centers. ”
6sigmaet dramatically streamlines model creation, gridding,
solving and post-processing. an automated process is used to completely convert
incoming computer aided design data to intelligent objects such as the chips,
capacitors, resistors and other components on a printed circuit board, and
complex shaped heatsinks, etc. a heatsink can be snapped onto a chip and a chip
can be snapped onto a board, eliminating much of the cumbersome positioning
required with primitive-based electronics cooling software. the intelligence
contained in every aspect of the model enables automatic meshing such as
increasing the grid density in critical areas.
the next generation design of 6sigmaet also
overcomes limitations of other electronics cooling software that struggles with
complex geometry. 6sigmaet
solves the conduction equations required to accurately simulate rotated or
angled geometry such as angled dimms. 6sigmaet also provides an updated user
interface that greatly reduces learning time and also reduces the time required
to perform nearly all basic modeling and reporting tasks.
advanced multigrid
solver technology makes the solution process faster and more robust. 6sigmaet
bases reporting on the intelligent objects in the model, such as the electronic
components, rather than abstract, geometric constructs, greatly reducing the
time needed to obtain information necessary to evaluate or characterize the
design.
6sigmaet is part of the 6sigmadc software suite,
which is the first thermal analysis software that addresses the complete design
chain running from printed circuit board design, to electronic systems such as
blades and servers, to rack-level systems, to the data center itself. 6sigmaets sister product 6sigmaroom can be
used to optimize the performance of the electronic system in the environment
where it is intended to be used. this makes it possible to
design equipment for next-generation configurations such as modular data centers
that contain fan-less servers.
next generation configurations are already heavily used in data centers such as
google’s data center a and are being eyed for other complex systems with high
electronics content such as military aircraft.
future facilities will be unveiling the newly
released 6sigmaet at two webcasts to be held on july 7th and 8th at 8 am and 11
am pdt respectively.
please visit www.futurefacilities.com/6sigmaet
to register.
about future facilities
future facilities (www.futurefacilities.com) is a
leading provider of powerful design, optimization and management software for
data centers and electronic equipment. the company’s approach provides the
methodology and tools to ensure all capacity, efficiency and reliability
criteria are met throughout all phases of the lifecycle from electronic systems
design through to facility operation.
for more
information about 6sigmaet,
visit www.futurefacilities.com/6sigmaet
Choose category and click GO to search for thermal solutions
a subscription to qpedia monthly thermal magazine from the media partner advanced thermal solutions, inc. (ats) will give you the most comprehensive and up-to-date source of information about the thermal management of electronics
if you have a technical article, and would like it to be published on coolingzone please send your article in word format to [email protected] or upload it here