consumer's demand improved performance, lower cost and smaller dimensions, so power devices must deliver high reliability in a smaller footprint. more functionality in a smaller space means greater heat generation, and power module producers have to manage the higher temperatures through efficient heat dissipation. henkel's loctite powerstratextreme (psx) phase change thermal interface materials address these needs. the materials offer high thermal conductivity and long-term reliability in a user-friendly printable or dispensable format, allowing for simple control of pattern and thickness. loctite psx products are particularly well-suited for power modules such as igbts, as the materials’ excellent cooling performance addresses space constraints through the ability to use smaller, lighter and more-effective heat sinks.

lead-free die attach technology for high power semiconductor devices
of course, it’s not just heat dissipation outside the package that’s important but also thermal and electrical control within the package, making robust die attach performance critical for high power applications. henkel’s latest ablestik die attach technology has been formulated specifically for high power semiconductor devices and offers excellent electrical and thermal conductivity, good thermal stability and good adhesion. designed to efficiently transfer heat generated from today’s high power packages, it is an effective alternative to soft solders, thereby delivering environmental compliance with lead-free initiatives. compatible for small and medium die sizes – from 2mm x 2mm up to 5 mm x 5 mm - with oven cure or snap cure capability, this die attach technology also provides superior process flexibility.

first reworkable underfill from loctite
henkel’s innovative solutions are evident throughout the company’s comprehensive portfolio of semiconductor packaging and electronics assembly materials. at smt nuremberg, show delegates can also find out about henkel’s latest assembly materials including a first-of-its-kind reworkable underfill. the new material, loctite uf3810, is a completely reworkable underfill with a high glass transition (tg) temperature of 100°c which delivers excellent thermal cycling reliability for wafer-level csp (wlcsp) and pop devices. the unification of high tg and reworkability is an underfill market breakthrough and allows manufacturers of high value devices such as handheld or aerospace applications to vastly improve yield, lower cost and maintain high reliability.

throughout the three-day smt nuremberg event, henkel experts will be on hand from stand #353 in hall 9 to answer questions about these products or any of the company’s comprehensive materials solutions. for more information, log onto www.henkel.com/electronics.