sager electronics’ aldo guarino wrote a recent post for electronics-sourcing.com in which he described heat as the “most common culprit in electronics system failure,” arguing that about 55 percent of failures can be directly linked to thermal management issues related to miniaturization and component density.

fifty-five percent of electronics failures are related to thermal issues. (wikimedia commons)

rather than being an “afterthought,” guarino said, thermal management has to be one of the first considerations in the design process.

he continued, “devices now require more power, efficiency and performance in increasingly small footprints. controlling temperatures in these tiny environments helps optimize performance and improve device longevity. this means that thermal management must be a strategic, design-in consideration.”

guarino points out that many of the thermal management solutions have not changed over time. engineers are turning towards fans, heat sinks, and heat pipes as they have in previous project, although he adds that the led, wearables and consumer electronics, and biomedical industries are areas of potential growth for the thermal management market, which could grow to nearly $20 billion in the next few years.

“engineers should look for partners that have the product depth and knowledge to help them design the best solutions for their application,” said guarino. “thermal management is a mission-critical technical consideration, so there is tremendous potential to build a specialization and offer expertise to customers.”

read the full article at http://www.electronics-sourcing.com/2016/09/29/turning-up-the-heat.