Coolingzone.com - Industry Developments: Thermal Potting Compounds and Epoxies

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September 2012

Industry Developments: Thermal Potting Compounds and Epoxies

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potting compounds may be used to provide an environmental barrier, dielectric protection characteristics, thermal conduction paths, and structural enhancement of an assembly or component.

many thermal epoxies are designed for the demanding needs of die-attach heat sink bonding and surface mount applications. this article explores the latest potting compound products on the market.

click here for the full article.

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