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Archived Magazines » September 2006

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Cold Plate Manufacturing Cost Drivers

Cold Plate Manufacturing Cost Drivers Cold plate prices can vary quite a bit; understanding why can help you cut costs and still obtain the performance you need to properly cool your application. The two biggest cost drivers in cold plate manufacturing are thermal performance requirements and annual demand, which generally thermal engineers have little or no control over. However, you can reduce costs by understanding how particular... details>>
 

Tony Kordyban in California

Tony Kordyban in California CoolingZone will bring Tony's one day short course to the Silicon Valley and Southern California in mid-November details>>
 

Taking the Plunge into Liquid Cooling - A Seminar & Factory Tour

Taking the Plunge into Liquid Cooling - A Seminar & Factory Tour Lytron will be sponsoring a 1-day liquid cooling seminar and factory tour in Woburn, Massachusetts (just north of Boston) on Tuesday, October 17th. The seminar will provide a thorough technical overview of liquid cooling, and will be geared towards the engineer or manager who has been using air cooling but recognizes that liquid cooling may be on the horizon for his/her application... details>>
 

Heat Sinks Cool Freescale Dual-Core Processors

Heat Sinks Cool Freescale Dual-Core Processors Two active and passive heat sinks cool Freescale MPC8641D Dual-Core PowerPC processors. details>>
 

Designing Premier CT-scan Systems

Designing Premier CT-scan Systems Analogic Corp., Peabody, MA, whose data acquisition systems are found in approximately three quarters of the world's Computed Tomography (CT) equipment, relies on Coolit CFD software from Daat Research Corp., to analyze the unique thermal problems posed by its CT applications. The software, selected for its ease-of-use, high accuracy, and power, delivers effective details>>
 

Anritsu Company Saves 4-6 Week PCB Re-Spin by Thermal Modeling in Early Design Stage

Anritsu Company Saves 4-6 Week PCB Re-Spin by Thermal Modeling in Early Design Stage Anritsu Company has reduced the time required to develop communications test solutions 4 to 6 weeks, eliminating a printed circuit board (PCB) re-spin by modeling thermal management at the board and systems level during the early design process. details>>
 

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