Press Releases
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Seeed Fusion Service Launches Free Assembly for 5 PCBs Offer
Established in the epicenter of high-tech design and manufacturing, Seeed Studio has been providing customers from all around the world with quality electronics and mechanical services. details>> -
Micro-LEDs Achieve Superior Brightness with Picosun ALD technology
Picosun Group, supplier of the leading AGILE ALD (Atomic Layer Deposition) thin film coating solutions, reports superb results in boosting micro-LED performance using ALD passivation. details>> -
nVent Offers On-Demand Industry-Leading Enclosures and Thermal Management Solutions
nVent Electric plc, a global leader in electrical connection and protection solutions, announced a program that helps ensure customers in the United States get the solutions they need when their business demands it. details>> -
Pasternack Releases New Temperature-Conditioned, Low-Loss RF Cable Assemblies
Pasternack, an Infinite Electronics brand and a leading provider of RF, microwave and millimeter wave products, has introduced a new line of temperature-conditioned, high-reliability RF cable assemblies that are ideal for avionics, military electronics, IFF, SATCOM, ECM and other mission critical applications. details>> -
Linear Systems Showcased New Testing Capability at DMEMS 2019
Linear Integrated Systems, Inc. (Linear Systems) will be showcasing its new large-scale sub-nanovolt parts testing capability at the Del Mar Electronics & Manufacturing Show (DMEMS) held May 1-2 at the Del Mar Fair Grounds, San Diego, Calif. details>> -
Equinix Acquires Switch Datacenters AMS1 Data Center Business in Amsterdam
Equinix, Inc., the global interconnection and data center company, announced that it has closed a transaction for the purchase of Switch Datacenters AMS1 data center business in Amsterdam, Netherlands, in an all-cash transaction for ?30 million ($34 million). details>> -
ANSYS Achieves Certification for TSMC Innovative SoIC Advanced 3D Chip Stacking Technology
TSMC certified ANSYS solutions for its innovative System-on-Integrated-Chips (TSMC-SoIC) advanced 3D chip stacking technology. details>> -
SEMI Partners with Powerhouses imec, CEA-Leti and Fraunhofer to Energize Global Innovation
SEMI announced that in the three months since imec joined SEMI as a Strategic Association Partner under a Memorandum of Understanding (MOU) announced at the SEMI Industry Strategy Symposium (ISS) in January. details>> -
IoTize TapNLink for Instant NFC, Bluetooth Available for Shipment Worldwide through Digi-Key
The IoTize line of TapNLink products for Bluetooth and NFC communication is available to customers around the world from Digi-Key Electronics, a global electronic components distributor. details>> -
Agility Unveils High-Performance Battery Packs and Electric Drivetrains for Trucks
Agility Fuel Solutions, a leading global provider of clean fuel solutions for medium- and heavy-duty commercial vehicles, introduced today at ACT Expo its high-performance battery packs and complete electric vehicle drivetrain integrations for medium-and heavy-duty trucks. details>>