Press Releases
-
Cambridge Nanotherm Delivers the First Commercial Order for its Ground-breaking Chip-on-Heatsink Technology in partnership with Optocap
Cambridge Nanotherm has announced, in partnership with Optocap, an advanced microelectronic and optoelectronic packaging design and assembly company, that the first ever Chip-on-Heatsink modules ordered have been shipped to a customer in the LED industry. details>> -
Vette Corp Expands Rear Door Heat Exchanger Offering for Data Center Liquid Cooling
Vette Corp announces an expanded liquid cooling product line for high density server, storage and communications equipment. Vette�s family of LiquiCool products now include Rear Door Heat Exchangers that are compatible with most leading brands of IT racks. Vette�s LiquiCool Rear Door Heat Exchanger replaces the rear door of a new or existing equipment rack and uses advanced liquid cooling... details>> -
Symscape Ships Caedium v5.1 for CFD
The latest version of Caedium (v5.1) has a new Helix tool for computational fluid dynamics (CFD) simulations and improved mesh element size control. details>> -
TDK-Lambda Releases Convection Cooled, 300-Watt Addition to the ZWS Line of Power Supplies
TDK Corporation announces the release of TDK-Lambda's latest addition to its ZWS line of compact AC-DC power supplies. The new single-output ZWS300BAF series provides 300-watts with convection cooling (no fans required). This design eliminates the need for fan maintenance and reduces acoustic noise and vibrations. These units have a low profile of only 1.45", and a compact footprint of... details>> -
The Bergquist Company Is Excited To Introduce Liqui-Bond SA 3505, The Latest Member Of Its Liquid Silicone Adhesive Line
Liqui-Bond SA 3505 is a higher performance, thermally conductive, liquid adhesive. This material is supplied as a two-part material and requires no refrigeration. The mixed material cures at elevated temperatures. As cured, Liqui-Bond� SA 3505 provides a strong bonding, form-in-place elastomer. The material's mild elastic properties assist in relieving CTE stresses during thermal cycling. details>> -
New Phase Change Material Simplifies And Speeds Assembly Of Heat Generating Electronic Assemblies
UniPhase 3500 from Universal Science provides a thermal management solution without the mess and inconsistency of thermal grease details>> -
New Web-Based Heat Transfer Calculator Launched By Morgan Advanced Materials
The Heat Flow application allows users to simulate an unlimited number of heat transfer scenarios using Morgan's market leading insulation and refractory products, as well as other user-defined materials. Users can register to create and manage their own material databases and calculations, details>> -
CoolIT Partners with Staubli and AFCO to Develop Standardized Rack Cooling Solutions
CoolIT Systems Inc., a top supplier of Direct Contact Liquid Cooling (DCLC�) solutions for high-performance desktops, enterprise servers and data centers is pleased to announce that Staubli and AFCO Systems have become a part of an effort to build liquid cooling industry standards. Evidence of these partnerships will be on display at ISC13 in both CoolIT's booth (301) as well as Staubli's booth... details>> -
Kobe Steel supplies high heat transfer titanium sheet for use in OTEC demonstration project in Okinawa
Kobe Steel, Ltd. has developed a high heat transfer titanium sheet called HEET� for use in plate heat exchangers, one of the important applications of commercially pure titanium sheet. Kobe Steel has supplied this material for use in the heat exchangers of an ocean thermal energy conversion (OTEC) power system in a demonstration project in Kumejima, Okinawa Prefecture. details>> -
JMC'S 40x50x32mm & 40x50x38mm Counter-Rotating Fans: Powerfully Efficient Airflow For High Density Electronic Enclosures
The DC fans are ideal for high-density 1U servers and power supplies or any other high-density electronic enclosures. Counter-rotating technology has allowed the engineers at JMC to design these fans with extremely powerful airflow and speed, while maintaining high efficiency and an outstanding performance (PQ) curve. details>>