Editorial

• New video explains process for embedding heat pipes into assemblies for cooling applications

  A new video from Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering company based in Norwood, Mass., outlines several of the processes that engineers can use to attach heat pipes to assemblies that remove heat from high-powered devices and electronics systems. details>>

• Microsoft patents thermal docking system for mobile computing devices

  According to a report from WindowsLatest.com, Microsoft has a new patent application in the works for a thermal dock for mobile computing devices, which would cool devices that were having thermal issues. details>>

• Space station researchers studying the complicated movement of fluids in space

  Researchers from the University of Stuttgart (Germany) Small Satellite Student Society (KSat e. V.) aboard the International Space Station have begun studying fluid movement using the power of magnets rather than pumps with mechanical, moving parts, as a means of minimizing the risk of mechanical failures on long space missions. details>>

• Environmentally-friendly and efficient heat pump designed to reduce energy costs

  Researchers at the Fraunhofer Institute for Solar Energy Systems (ISE) in Freiburg, Germany have created a heat pump that uses propane rather than standard synthetic refrigerants that they believe is more environmentally-friendly and efficient. details>>

• Chinese company releases new 18-terahash liquid-cooled bitcoin mining rig

  Bitmain Technologies, a China-based bitcoin mining company and one of the largest in the world, has released the Antminer S9 Hydro, which a water-cooled SHA256 bitcoin miner that can reach a hashrate of nearly 18 trillion hashes per second (TH/s). details>>

• German overclocker creates intense new liquid cooling system for Epyc server

  The German overclocker der8auer worked with German computing company Caseking to produce an interesting liquid cooling solution for a 64-core dual Epyc server, according to a report and video from PC Gamer. details>>

• New study investigating properties of hybrid organic-inorganic semiconductors

  A new study being led by the U.S. Department of Energy (DOE) National Renewable Energy Laboratory (NREL) will study hybrid organic-inorganic semiconductors (HOIS) to better understand and control spin, charge and light-matter interactions in these materials. details>>

• Tests of leaked Intel Core i7-9700K chips show impressive benchmarks with liquid cooling

  Engineering samples of Intel i7-9700K chips have been tested by users and the leaked results are impressive with overclockers reaching 5.5 Ghz across all eight cores with water cooling and not liquid nitrogen, according to a report from TechSpot. details>>

• Google tuns data center cooling over to AI to reduce energy usage by 40 percent

  DeepMind Technologies, an artificial intelligence (AI) company based in London (U.K.) that was purchased by Google in 2014, recently announced that it is applying its machine learning algorithms to Google data centers to reduce the amount of energy dedicated to cooling by as much as 40 percent. details>>

• Galaxy Note 9 using carbon-fiber heat pipes to improve performance

  Samsung recently released its latest smartphone, the Galaxy Note 9, and one of the biggest revelations about the phone (especially for coolingZONE readers) is the inclusion of carbon-fiber heat pipes to spread the heat away from the processor. details>>