Editorial

• Imec unveils 3-D printed impingement cooling solution for high-powered chips

  Imec, a Belgium-based research and development hub focused on nanoelectronics and digital technologies, recently demonstrated a novel and cost-effective impingement solution for cooling high-performance chips at the package level. details>>

• Do imperfections in phase-change material impact thermal performance

  Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering and manufacturing company focused on the thermal management of electronics, recently published an article that explained the insignificant impact that wrinkles or dents in phase-change material (PCM) have on the thermal performance of a heat sink. details>>

• ACT announces new patent for heat pipe assembly to cool satellites

  Advanced Cooling Technologies, Inc. (ACT) recently announced that it had received approval from the U.S. Patent and Trademark Office for its Constant Conductance Heat Pipe (CCHP) Assembly for High Heat Flux (U.S. Patent 9,952,000). details>>

• Oak Ridge Lab, IBM, and Nvidia unveil Summit, most powerful scientific supercomputer

  The U.S. Department of Energy (DOE) Oak Ridge National Laboratory (Oak Ridge, Tenn.), in partnership with Nvidia and IBM, has revealed Summit, the most powerful and smartest scientific supercomputer in the world. details>>

• Lenovo, EVGA, and Facebook roll out new liquid cooling solutions

  Liquid cooling has become a popular thermal management tool for a variety of applications, from home computing to servers and data centers, and in the last month three mainstays in the industry have revealed new liquid cooling designs that for data centers, and overclockers. details>>

• Innovative baffles keep electronics cool on NASA space telescope

  According to a recent article by ECN, NASA has developed several innovative cooling technologies that are being used on the James Webb Space Telescope. details>>

• Exploring the performance of nanomaterials in the extremes of space

  A recent article from Physics World outlined studies that have been conducted to determine how certain nanomaterials will withstand the extreme environments of space and the various applications that nanomaterials can be used in space travel. details>>

• Artificial blubber from MIT protects divers in frigid water

  Researchers at the Massachusetts Institute of Technology (MIT) in Cambridge have developed a simple treatment that can improve the survival time for a conventional wetsuit by a factor of three. details>>

• Nanodiamonds used to boost thermal properties of 3-D printed polymers

  Carbodeon has announced a partnership with Tiamet 3D to produce the first nanodiamond-enhanced filaments for 3-D printing, which improves the mechanical and thermal properties of the resulting polymers. details>>

• Thermoelectric assemblies provide another option for electronics cooling

  A recent article published by Advanced Thermal Solutions, Inc. (ATS) explored recent developments in the use of thermoelectric assemblies (TEA) in electronics cooling applications from laser diodes to medical and industrial instrumentation. details>>