Editorial

• Chameleon-like material could be key to next-gen computers

  Researchers at Texas A&M University (College Station, Texas) have developed a novel chameleon-like, phase-change material by adding tungsten to vanadium oxide that they believe could provide for more powerful computers than the current silicon-based technology. details>>

• Immersion cooling at chassis level proves effective in NREL tests

  Bloomington, Minn.-based LiquidCool Solutions has developed an immersion cooling system that can be deployed at the chassis level, is safe, cost-effective, and the company claims can capture 95 percent of the heat energy from high-density server components. details>>

• Article explores industry developments in thermal interface materials

  A recent article from Norwood, Mass.-based thermal engineering design and manufatcuring company Advanced Thermal Solutions, Inc. (ATS) explores some of the more recent industry developments in thermal interface materials (TIMs) and how they are used in the thermal management of electronics. details>>

• U.K. company using additive manufacturing to enhance heat exchangers

  According to a recent report from 3DPrint.com, U.K.-based HiETA Technologies is working with British metrology company Renishaw to move from prototyping to commercialization of its metal 3-D-printed heat exchangers. details>>

• ADATA showcases unique cooling for Project Jellyfish at CES 2018

  Taiwanese memory and storage manufacturer ADATA Technology revealed an exotic cooling solutions for its Project Jellyfish DDR4 DIMM at the recent CES 2018 show in Las Vegas, Nevada. details>>

• Article looks at thermal management challenges of solid-state relays

  A recent article published by MachineDesign.com, written by Rogelio Castaneda and Oscar Rivera of Sensata Technologies, explains the thermal challenges that solid-state relays (SSR) face and some of the solutions that can prevent failure due to excessive heat. details>>

• Program seeks to break separation between data storage and processors

  The new center will bring together researchers from eight universities to break the separation between data storage and data processors that has been present since current computer architecture was adopted in 1945. details>>

• Brick filled with aerogel provides thermal insulation for buildings

  Researchers at Empa (the Swiss Federal Laboratories for Materials Science and Technology) in Dubendorf, Switzerland have developed a paste of highly-porous aerogel particles with high thermal insulation properties to be used as filler material for bricks. details>>

• Purdue researchers solve four-phonon thermal conductivity obstacle

  Researchers from Purdue University (West Lafayette, Ind.) and the Oak Ridge National Laboratory (Oak Ridge, Tenn.) have demonstrated a method for accurately modeling the interactions of four phonons and the impact they have on thermal conductivity in solid materials. details>>

• New Zealand professors using 3-D printing to make heat exchangers

  Two professors from the University of Canterbury (UC) in Christchurch, New Zealand, Conan Fee and Dr. Tim Huber, were recently awarded one of the five prizes in the annual UC Tech Jumpstart competition for using 3-D printing to create high-performance heat exchangers. details>>