Featured

• Study shows fluid-like heat flow in solid semiconductor at nanoscale

  Thanks to thermal imaging techniques, researchers at Purdue University (West Lafayette, Ind.) are now using the same hydrodynamic transport model that is used in the study of fluid flow to describe heat transport in solid semiconductors. details>>

• Article explains how to achieve localized cooling with cold plates

  A recent article from Advanced Thermal Solutions, Inc. (ATS), a thermal engineering design and manufacturing company based in Norwood, Mass., explains the steps and calculations that are necessary for providing localized cooling using liquid cold plates. details>>

• New method developed to study thermodynamics of hot melts

  Researchers at the Massachusetts Institute of Technology (MIT) in Cambridge, Mass. have developed a new, container-less electrochemical method for studying the thermodynamic properties of materials such as aluminum oxide that have ultra-high melting points. details>>

• Fujitsu Labs announce development of highly conductive carbon nanotube sheet

  Fujitsu Laboratories (Kawasaki, Japan) announced in November that it has successfully developed a carbon nanotube sheet that is highly thermally conductive and has the top heat dissipation performance in the world that is targeted at electric vehicles and will replace silicon carbide (SiC). details>>

• Topological materials could boost efficiency of thermoelectric devices

  A study at the Massachusetts Institute of Technology (MIT) in Cambridge, Mass. has identified the underlying property that makes topological materials potentially more efficient thermoelectric materials than conventional semiconductors such as silicon. details>>

• White paper examines thermal management challenges in IoT

  The Intel Internet of Things Group (IOTG) released a white paper that outlines some of the thermal challenges facing the growth of IoT infrastructure and how it used Mentor software to help test possible solutions to better serve customers. details>>

• Physicists have cooled a nanoelectronics chip to lower than 3 millikelvin

  Scientists at the University of Basel (Switzerland) have successfully cooled a nanoelectronics chip to a temperature lower then three millikelvin, setting a new world record for the coldest chip thanks to a magnetic cooling process. details>>

• Quantum sensor size of a nitrogen atom to investigate hard drives

  Researchers at the Fraunhofer Institute for Applied Solid State Physics IAF in Freiburg, Germany have partnered with scientists at the Max Planck Institute for Solid State Research in Stuttgart, Germany to develop a quantum sensor that can measure the nanoscale magnetic fields that are expected to be in the next generation of hard drives. details>>

• Novel intra-chip micro-cooling system developed for supercomputers

  Researchers at Purdue University (West Lafayette, Ind.) have created a novel cooling system for radars and supercomputers that circulates liquid coolant through microchannels and directly onto electronic chip stacks that is capable of dissipating as much as 1,000 watts per square centimeter. details>>

• Article examines thermal performance of microchannel cold plates

  A recent article from thermal engineering company Advanced Thermal Solutions, Inc. (ATS) examined the thermal performance of both macrochannel and microchannel liquid cold plates in the cooling of electronics. details>>