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when performing an analysis of heat generating electronic components on a printed circuit board (pcb or pwb), the pcb is often used to dissipate a significant portion of the heat. some components are designed to dissipate heat with the use of a heat sink, and they often have a low resistance from their junction to case (θjc) in order to facilitate the thermal transfer.

when specifying heat sinks for these components, the heat dissipated through the pcb can still be significant, but it depends on operating conditions and pcb design. 

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