Press Releases
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Adcol Announces New Mini Dehumidifier for Power Cabinets
Adcol, a leading provider of Thermoelectric Cooling Systems, today introduced a new TE device - mini dehumidifier for the power cabinet market. The miniature unit has an outside dimension of 135mm x 120mm x 115mm, power consumption of 40W and is designed specifically for power cabinets to improve power supply reliability. details>> -
CPC Expands Offering of Non - Spill Couplings
CPC (Colder Products Company), the leading provider of quick disconnect couplings and fittings for plastic tubing, announces the expansion of its NS4 Series quick disconnect couplings to now include elbow insert configurations. The lightweight, innovative couplings provide secure and reliable drip-free performance. Easy-to-use NS4 Series couplings include shutoff valves that ensure drip-free... details>> -
Techsil Announces TIM11021 and TIM11123 Thermal Interface Materials
Techsil introduces 2 new one-component thermal interface materials to the market, the TIM11021 and the TIM11123. Techsil TIM11021 is a 1-part grey paste silicone non-curing compound that provides high thermal conductivity with low bleed and minimal weight loss at elevated temperatures; successfully operating at a wide temperature range of -40 degree C to 150 degree C with a thermal conductivity... details>> -
GlacialTech Launches Two Cold Forging Thermal Module Solutions: Igloo FR210 and Igloo FR210HP
GlacialTech Inc., an experienced technology manufacturer, launched two new cold forging thermal modules: Igloo FR210 and Igloo FR210HP. Igloo FR210 / Igloo FR210HP. Both the Igloo FR210 and Igloo FR210HP are suitable for 80W applications. The Igloo FR210HP differs from the Igloo FR210 in that it optimized for CoB and spotlight applications. These modules' heatsinks are available in two color... details>> -
Carbodeon Develops Nanodiamond Composite Thermally Conductive Thermoplastics With 20%-100% Improvement In Thermal Conductivity.
Carbodeon's uDiamond nanodiamond materials can now achieve a 20 percent increase in polymer thermal performance by using as little as 0.03 wt.% nanodiamond material at 45 percent thermal filler loading, enabling the further performance at a lower cost than made with traditional fillers. Samples were manufactured at VTT Technical Research Centre of Finland and their thermal performance was... details>> -
FLIR Systems Announces AX8 Thermal Imager for Industrial Automation
The new FLIR Systems AX8 thermal imager has 4,800 active temperature points per image, provides streaming temperature data over industry-standard interfaces (Ethernet/IP and Modbus TCP) for easy analysis, has a built-in web interface, and includes a full suite of Analysis and Alarm functions that automatically send alerts when the AX8 detects elevated temperatures. details>> -
Henkel to acquire The Bergquist Company
Henkel signed an agreement to acquire The Bergquist Company, a privately-held leading supplier of thermal-management solutions for the electronics industry worldwide. details>> -
Thermal Imaging And Analysis For High Speed Semiconductor Devices
Microsanj announces the availability of a new high performance thermal analyzer in the Thermoreflectance Nanotherm Series. The NT410A has a time resolution of 800 picoseconds, sub-micron spatial, 1 degree C temperature resolution, and mega pixel full field thermal images. Tthe NT410A can provide device designers with important time-dependent thermal performance data that was, up to now, not... details>> -
NEW Sarcon SPG-20B Delivers Lower Thermal Resistance and Higher Thermal Conductivity
Fujipoly introduces a new version of its popular SARCON SPG-15A, form-in-place thermal interface compound. The new SARCON� SPG-20B formulation is an easy to dispense, low-viscosity thermally conductive silicone that delivers a thermal conductivity of 2.1 W/m degree K and a thermal resistance of only 1.8 degree C cm2/W. This is roughly a 51% improvement in thermal resistance and a 40% improvement... details>> -
Ellsworth Adhesives Exhibiting at Design2Part in Portland
Ellsworth Adhesives, a global distributor of adhesives, specialty chemicals and dispensing equipment, is pleased to announce that they will be exhibiting at this year's Design2Part Exposition October 29 and 30 at the Portland Expo Center in Portland, Oregon. Ellsworth Adhesives is displaying the latest technology of adhesives and dispensing equipment for manufacturing in Booth 327. Through... details>>