Press Releases

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  IDT and Telink Semiconductor Announce Partnership on Integrated Sensor Platforms

  Leveraging respective leadership technologies in sensors and IoT connectivity, Integrated Device Technology, Inc. (IDT) and Telink Semiconductor are announcing a partnership to create connected and integrated sensor platforms for IoT applications. details>>
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  New ventilated sensor enclosures from Hammond Electronics

  The new 1551V miniature ventilated sensor enclosures from Hammond Electronics are designed to house sensors and small sub-systems installed in the manufacturing environment as part of IoT systems. details>>
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  Anomatic Acquires Injection Molding Company CP Technologies

  Anomatic Corporation, a full-service manufacturer of anodized aluminum and metallized packaging solutions, has announced the acquisition of CP Technologies Company, an injection molding firm located in Columbus, Ohio. details>>
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  Picosun ALD Encapsulation Prevents Electronics Degradation

  Picosun Group, a leading supplier of ALD (Atomic Layer Deposition) thin film coating solutions for global industries, reports unprecedented results in high reliability electronics protection with ALD. details>>
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  Achronix Announces Partner Program for Speedster, Speedchip, and Speedcore Ecosystem

  Achronix Semiconductor Corporation announced the launch of its Partner Program for EDA tools, software, and IP vendors with solutions and services directly applicable to Achronix versatile Speedster FPGAs, Speedchip chiplet technology, and Speedcore eFPGA custom IP-block technology. details>>
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  ANSYS Twin Builder Empowers Organizations to Optimize Product Operations

  ANSYS is enabling product developers to potentially save millions of dollars in warranty and operational costs with the latest release of ANSYS Twin Builder. details>>
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  Plugable Launches Tool-free USB-C NVMe SSD Enclosure

  Plugable launches the 10Gb USB-C (USB 3.1 Gen 2) NVMe SSD Enclosure, the first high performance NVMe enclosure to feature a completely tool-free, spring-loaded design for inserting and removing a compatible SSD. details>>
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  Modine Launches High-Efficiency Motor Enhancement for Cabinet Unit Heaters

  Modine Manufacturing Company, a leader in technology in the HVAC industry, has launched another HVAC enhancement with the addition of an Electronically Commutated (EC) Motor to its cabinet unit heater offerings. details>>
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  Boeing and Safran Announce New APU Joint Venture Named Initium Aerospace

  Boeing and Safran announce the name of their 50-50 joint venture to design, build and service Auxiliary Power Units (APUs): Initium Aerospace. details>>
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  Magewell Expands Pro Convert NDI Encoder Roster with Fourth Powerful Model

  Magewell has unveiled the new Pro Convert SDI Plus standalone NDI encoder, the fourth entry in its rapidly-expanding Pro Convert family of devices for bringing traditional video signals into IP-based production networks using popular NewTek NDI technology. details>>