Press Releases

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  Phononic Announces General Availability of Non-Hermetic Thermoelectric Cooler

  Phononic, the global leader delivering disruptive and sustainable solid-state thermal management solutions, announced the general availability of ReefTEC TM, its proprietary Non-Hermetic Compatible Thermoelectric Cooler (TEC) Platform. details>>
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  Indium Launches Die-Level Bonding Solder Composite

  Indium Corporation has launched InFORMS ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level attach applications. details>>
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  Teledyne LeCroy Demonstrates Protocol Analyzer Platform for USB4 and Thunderbolt 3 Systems

  Teledyne LeCroy, Inc., the worldwide leader in USB protocol test solutions and a business unit of Teledyne Technologies Inc., announced and demonstrated the first protocol analyzer platform for testing next-generation USB4 and Thunderbolt 3 systems. details>>
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  Hackaday Flexible PCB Contest Launches on March 6

  Digi-Key Electronics and Hackaday are teaming up for the Flexible PCB Contest and challenging makers to get creative with a board design 2 square inches (13 square cm) or smaller. details>>
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  Fractal Design introduces Prisma fan series

  Fractal Design announced the release of the new Prisma family of LED case fans with Adjust R1 RGB Controller accessory. details>>
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  PolarFire FPGA-Based Solution Enables Lowest-Power 4K Video and Imaging Applications

  The new PolarFire FPGA imaging and video solution from Microchip Technology Inc. addresses these challenges by delivering capabilities superior to alternative technologies to support resolution as high as 4K in small, low-power form factors necessary for a wide variety of imaging and video applications. details>>
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  Qorvo Ships 100 Million RF Devices for 5G Wireless Infrastructure

  Qorvo, a leading provider of innovative RF solutions that connect the world, announced that it has shipped over 100 million 5G wireless infrastructure components since January 2018. details>>
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  TI Partners with Digi-Key to Sponsor TechMatch Start-Up Competition

  Twelve start-ups entered the race for prizes totaling over $34,000 at the TechMatch start-up competition run by semiconductor manufacturer Texas Instruments (TI) and partners including Digi-Key Electronics, a global electronic components distributor, on January 31, 2019 in Bielefeld, Germany. details>>
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  Micron Accelerates the Mobile Computing Experience With Introduction of New Client SSD

  Micron Technology, Inc. added a new cost-efficient solid-state drive (SSD) to its client computing portfolio. details>>
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  Future Tech Enterprise, Inc. Introduces Collaborative Virtual Reality (CVR) Appliance

  At the GPU Technology Conference (GTC), Future Tech Enterprise, Inc. will debut its new 3D-printed, Collaborative Virtual Reality (CVR) appliance. details>>