The thermal engineering challenges at the device and microprocessor level are substantial.  In this excellent lecture by Dr. Medhi Asheghi of Stanford University, he addresses those challenges and how to solve them.   Dr. Asheghi addresses:

• Device and Interconnect Level Cooling
• Microprocessor Level Thermal Design
• Nanostructured Thermal Interface Materials

The lecture is about 55 minutes and you can see it by clicking the video below.