TE Connectivity performs a thermal demonstration on its new microQSFP. The demo includes: 7.2 Tbps of external I/O throughput with microQSFP form factor (MPO version), 6.0 Tbps of internal throughput using Sliver (on-board or embedded copper cable), and 7 – 40mm fans generating 50~100 CFM total.

Learn more about the product at http://www.te.com/usa-en/home.html.