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coolingzone tech newsletter 2/23/18 february 22, 2018
top stories
thermoelectricity from pencil and paper
researchers used a normal pencil, photocopy paper, and conductive paint to produce a thermoelectricity.
cryptocurrency mining using liquid cooling
engineer neil birtles details his new design for an immersed, oil-cooled crypto-currency miner for verium.
thermoelectricity from ambient temps
mit researchers developed a thermal resonator that uses the swings in ambient temperature to produce electricity.
immersion cooling boosts ev batteries
a new immersion cooling technology from taiwan could be key to efficient ev batteries.
coolingzone update
check out new videos on cooltv
cooltv, coolingzone's engineering and science information channel, has videos about the thermal management industry from product demos to webinars.
explore coolingzone library for thermal management research
explore the extensive coolingzone library to find loads of research, case studies, and technical articles on all aspects of thermal management.
check out the new cold plate supplier directory
coolingzone introduced a new cold plate supplier directory to assist industry members looking for the latest developments in liquid cooling.
product & industry news
ats to showcase new cold plates for power electronics at apec 2018
advanced thermal solutions, inc. (ats), a leading-edge thermal engineering and manufacturing company focused on the thermal management of...
ansys discovery live enables real-time digital exploration for every engineer
ansys is revolutionizing product engineering by enabling engineers to create smarter designs faster and more efficiently with the commercial release...
i-connect007 launches 'thermal management with insulated metal substrates' ebook
i-connect007 is excited to announce the release of the latest title in its micro ebook design series.
ti wide voltage input synchronous converters feature industry-leading thermal performance
texas instruments (ti) introduced two families of wide-vinsynchronous dc/dc buck regulators with industry-leading electromagnetic interference (emi)...
electrolube launches non-silicone zinc oxide free thermal paste
electrolube announced the launch of a new non-silicone heat transfer compound, htcx_zf.
samsung begins production of embedded universal flash storage for automotive applications
samsung electronics co., ltd., the world leader in advanced memory technology, announced that it has begun mass production of a 256-gigabyte (gb)...
ball aerospace delivers flight cryocooler early for nasa landsat mission
ball aerospace delivered the tirs-2 flight cryocooler for the landsat 9 tirs-2 instrument ahead of schedule to the nasa goddard space flight center...
arctic introduces the freezer 33 esports one
arctic adds a new model to its successful freezer 33 series: the freezer 33 esports one.
meggitt awarded $26 million contract from general dynamics land systems
meggitt plc, has received a $26 million contract to provide thermal management systems (tms) to general dynamics land systems.
detector technology, inc. acquires scientific instrument services
detector technology, inc., a leader in analytical instrument contract design and manufacturing, with a focus on mass spectrometry and sample...
technology corner
harnessing background room heat to create thermoelectric energy [coolingzone]
researchers from the university of tsukuba (japan) have developed a thermoelectric, thin-film system from two redox materials that harnesses small...
engineering in the twilight of moore's law [ieee spectrum]
while transistors are continuing to shrink, it's at a slower pace. the technology road map calls for 5-nanometer fabrication by about 2020, but...
400g ethernet poses thermal and signaling challenges [electronic design]
the ieee's 400 gigabit ethernet standardization process was completed and published in december 2017 by the ieee 802.3bs ethernet working group....
modeling and simulation for meeting the challenges of battery design [wind power engineering]
the biggest challenges for battery design are energy density, power density, charging time, life, cost, and sustainability. modeling and simulation...
how piezo controller design influences thermal stability [azonano]
in this interview brian o'connor of aerotech, inc. speaks to azonano about how piezo controller design influences thermal stability.
engineering how to
how to calculate pcb heat transfer
in this video from altium, chris carlson, an expert on pcb design, explains how to calculate the heat transfer through a printed circuit board (pcb).
how to apply thermal conductive polymer in electronics cooling
this video explores the increasing use of thermal conductive polymer (tcp) in passive cooling of electronics. the video explains the characteristics...
how to optimize heat sinks in non-confined flow
the majority of heat sinks used for cooling of electronics are probably of this type. much of the physics is the same as for the non-bypass case but...

conferences & webinars
international conference on boiling and condensation heat transfer
march 12-15, 2018 - nagasaki, japan - the 10th international conference on boiling and condensation heat transfer (icbcht2018) will be held from 12th - 15th march, 2018 in nagasaki, japan. this conference is the latest in a series that has been held in santa barbara, banff, irsee, alyeska, jamaica, spoleto, florianopolis,...
march 19-23, 2018 - san jose, calif. - attendees include anyone interested in thermal design, management and characterization of electronic systems and components. semi-therm provides a forum for engineers, academics, and executives to learn, exchange ideas, and display the latest in thermal management techniques, products...
conference on integrated power electronics systems
march 20-22, 2018 - stuttgart, germany - we invite all engineers coming from industry and academia engaged in power electronics-related to system development, component development, reliability engineering, and research to learn more about the latest research and technical achievements by joining cips.

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