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coolingzone tech newsletter 3-23-18 march 23, 2018
top stories
thermal switch for electronic devices
a team of researchers developed technology that breaks the heat flow allowing engineers to turn heat on and off.
nanodiamonds produce stong 3-d printed products
researchers produced the first nanodiamond-enhanced filaments for 3-d printing to improve mechanical and thermal properties.
creating reliable nanoscale semiconductors
researchers created a more efficient nano-scale fabrication process to produce powerful and reliable semiconductors.
thermoelectric assemblies in electronics cooling
a recent article explored developments in the use of thermoelectric assemblies (tea) in electronics cooling applications.
coolingzone update
check out the new cold plate supplier directory
coolingzone introduced a new cold plate supplier directory to assist industry members looking for the latest developments in liquid cooling.
join supplier directory and promote your business
join the coolingzone supplier directory and promote your business to thousands of engineers from across the thermal management industry.
product & industry news
ats offers portable anemometer for measuring airflow velocity
the ats-0345-1 from advanced thermal solutions, inc. (ats) is a portable vane anemometer for measuring air flow speed and volumetric flow rate.
future facilities launches neutral file format for thermal simulation models
future facilities, provider of leading thermal simulation tool, 6sigmaet, has announced the availability of a new neutral file format that will help...
tt electronics introduces lightest, most effective pcb mounted heatsink for power resistors
tt electronics, a global provider of engineered electronics for performance critical applications, has announced the wmhp-hs heat sink specifically...
cavium expands industry partnerships to drive ocp nic 3.0
cavium, inc. announced that it is collaborating with hewlett packard enterprise (hpe), to bring hyperscale-inspired designs based on open compute...
microsemi announces adaptec smart storage compatibility with amd epyc processor
microsemi corporation announced interoperability between its 12 gigabits per second (gbps) sas/sata host bus adapters (hbas) and redundant array of...
larson electronics llc releases 100w portable explosion proof led
industrial lighting leader, larson electronics llc, announced the release of a 100-watt explosion proof led lamp, mounted on a portable non-sparking...
ers electronic announces aircool prime thermal chuck tech will soon be available
ers electronic, the leader in the market of thermal test solutions for semiconductor, is announcing that its aircool prime thermal chucks will soon...
neo tech releases new ltcc and aln design guidelines
neo tech announces that it recently produced and published new and expanded guidelines for the manufacture of low-temperature co-fired ceramic (ltcc)...
qorvo introduces most powerful gan-on-sic transistor
qorvo, a leading provider of innovative rf solutions that connect the world, introduced the highest power gallium nitride on silicon carbide...
axcelis announces new purion h order from leading advanced logic chip maker
axcelis technologies, inc., a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced that it has...
technology corner
physicists discover new quantum electronic material, kagome metal [coolingzone]
scientists from the massachusetts institute of technology (mit) and harvard university, both in cambridge, mass., and the lawrence berkeley national...
installing open-frame and u-channel ac-dc power supplies [electronic design]
engineers must be wary of safety, electromagnetic-compatibility, and thermal-management factors when installing open-frame and u-channel power...
how to prevent electrical motors from over-heating with thermally protected solid-state relays [ecn]
what do conveyor belts, assembly lines, medical, energy, industrial/commercial hvac and refrigeration systems, heavy-duty transport and construction...
why keeping cool keeps output high [power engineering]
gas turbines (gts) operate at a constant volume of (hopefully) very clean air. it's the density of this air however (weight per unit volume) that...
cabled backplane systems: the high-speed alternative to pcbs [pd net]
as data center equipment speeds continue to increase, traditional fr4 printed circuit board (pcb) substrates may no longer provide acceptable...
engineering how to
how to make a thermocouple
in this how to video from advanced thermal solutions, inc. engineer greg wong shows how to make thermocouples. this video will show you how you can...
how to select a heat sink for cooling electronics
this video looks at the basic principals when selecting a heat sink for electronics or electrical devices.
how to measure the thermal conductivity of liquids
measuring the thermal conductivity of liquids is made easy using the c-therm tci thermal conductivity analyzer.

conferences & webinars
embedded systems conference
april 18-19, 2018 - boston, mass. - esc returns to new england with a fresh, in-depth educational program designed specifically for the needs of today's embedded systems professionals. with four in-depth tracks, new technical tutorials, and a host of top engineering talent on stage, you'll get the specialized...
advanced thermal management 2018
april 19, 2018 - baronette renaissance novi, mich. - the annual advanced thermal management 2018 conference provides attendees with a forum to address the latest vehicle, systems, components, and materials challenges and solutions. sign up to attend and join industry experts for a full day of presentations and face-to-face...
high temperature electronics
may 8-10, 2018 - albuquerque, n.m. - hitec 2018 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. under the organizational sponsorship of the international microelectronics assembly and packaging...

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