11th International Business & Technology Summit

rusty robertson

stäubli corporation

www.staubli.com

benefits of system modularity in consideration of lifecycle management

 virtually every product has an element of lifecycle management associated with it. the more critical that the component is to the success of a larger system, the more important it becomes to retain the ability to manage those components individually. this certainly applies to thermal management components as well as the systems that they are designed to protect.

system modularity can help to gain efficiencies in the manufacturing process, can provide for more functional flexibility of systems, and also expedites the replacement of portions of the installed system, whether for periodic maintenance, as part of a scheduled up-grade program, or due to failure.

as component designers, engineers and manufacturers, we must be able to know how, and where, modularity adds value to a system and provide the benefit of our experience to those dictating the overall system specifications. conversely, by offering incorrect or inadequate solutions, we can create conditions that not only might jeopardize the entire system, but that would have potentially disastrous business implications.

barbara massolin

coolit systems

www.coolitsystems.com 

 server power reduction through on-chip liquid cooling

for many years, thermal management has continued to depend on air based heatsink-fan applications. through the demand for "over-clocked" processors in the high performance desktop, sealed liquid cooling systems have become mainstream and now demonstrate the performance and reliability necessary to be viable options for the datacenter server.  as reducing power consumption of datacenters becomes increasingly important, every aspect of the server becomes an opportunity to improve power efficiency. 

in this session, the successful development of a 1u liquid cooling system is showcased with the design goal of reducing total power consumption of the server while accommodating additional design considerations for system life, dimensional constraints, manufacturability, cpu power headroom and cost.