coolingZONE-12 Thermal Management of Electronics eConference (August 29th and 30th) (test)

Conference Program

	wednesday program august 29th, 2012
7:30	host introduction and opening remarks

8:00	keynote address
	intrachip microfluidic cooling - gen3 thermal packaging technology

	avram bar-cohen, ph.d. program manager, darpa-microsystems technology office

	from the dawn of the information age thermal management technology has played a key role in the continuing miniaturization, performance improvements, and higher reliability of electronic systems. during the past 65 years, thermal packaging has migrated from ventilation and air-conditioning to cabinet cooling, to package cooling with heat sinks and cold plates, and is today addressing on-chip hot spots and near-junction thermal transport. following a brief history of thermal packaging, attention will turn to a review of emerging darpa-driven micro and nano-technologies for reducing the thermal resistance of defense electronic systems. the asymptotic maturation of current technology and growing thermal management demands in high performance computing and rf systems have led darpa to initiate efforts in third-generation thermal management technology based on intrachip and interchip microfluidic cooling. the motivation, technological thrusts, and promise of this new thermal management paradigm will be discussed.

9:15	technical presentation (tbd/exhibitor)

10:00	materials for microelectronic and led heat dissipation

	deborah d.l. chung, ph.d. director, composite materials research laboratory niagara mohawk chair professor of materials research professor of mechanical and aerospace engineering university at buffalo, state university of new york

	overheating is one of the biggest problems in the microelectronic and led industries, as it limits the power, reliability, performance and further miniaturization. this problem particularly affects high-performance and high-power devices. for heat dissipation from a hot surface, heat needs to flow from the hot surface to a heat sink or a heat spreader. a heat sink is a thermal conductor that has a considerable heat capacity so that it serves as a sink for the heat. a heat spreader is a thermal conductor that serves as a conduit to channel the heat away from the heat source. heat is dissipated from both heat sink and heat spreader to the environment. suitable thermal insulation to avoid the dissipated heat to degrade nearly electronic components is often needed. due to the low thermal expansion coefficient of semiconductors and their substrates, a low thermal expansion coefficient is preferred for the heat sink/spreader; otherwise, thermal fatigue may occur upon temperature cycling. the effectiveness of the heat flow from the heat source to the heat sink/spreader is partly governed by the quality of the thermal contact between the heat source surface and the surface of the heat sink/spreader. improvement of the thermal contact requires a thermal interface material, which needs to be conformable. conformability is essential due to the need to displace the air from the interface between contact surfaces that are necessarily not completely smooth. as long as the thermal conductivity exceeds that of air, a highly conformable thermal interface material is able to improve a thermal contact. a heat spreader can be isotropic or anisotropic; the latter has a low through-thickness thermal conductivity but a high in-plane thermal conductivity and has the advantage of providing some degree of thermal insulation so that the heat evolved does not affect the nearby electronic devices. the performance of isotropic and anisotropic heat spreaders depends on both the material and the dimensions, as shown by a heat conduction model.

11:15	technical presentation on thermal interface material (t-global)

	dr. philip blazdell

	speaker confirmed/abstract pending

12:00	near junction thermal engineering of microelectronic devices

	mehdi asheghi, ph.d. consulting associate professor, mechanical engineering department, stanford university,

	speaker confirmed/abstract pending

1:00	lunch

2:00	high-performance thermal management materials

	carl zweben, ph.d. advanced thermal materials consultant life fellow, asme; fellow, sampe & asm; associate fellow, aiaa

	in response to well-recognized needs, there have been revolutionary advances in thermal management materials. silicon carbide particle-reinforced aluminum (al/sic), which was first used in thermal management by the speaker’s group at ge in the 1980s, is now well established. by replacing a copper base plate with al/sic, one igbt supplier “eliminated solder fatigue”, extending guaranteed life from 10 to 30 years. there are an increasing number of new materials with low coefficients of thermal expansion (ctes) and low densities having thermal conductivities up to 1700 w/m-k. some are cheaper than traditional materials. payoffs include: increased reliability; reduced junction temperatures and weight; low-cte, thermally conductive pcbs, potentially eliminating the need for underfill; cte matching allows direct attach with hard solders, reducing thermal resistance and solder fatigue. there are a large and increasing number of microelectronic and optoelectronic applications, including: pcbs and pcb cold plates; heat sinks; microprocessor, rf and power modules; heat spreaders and sinks; led and laser diode modules; thermoelectric coolers; plasma and lcd displays; detectors; and photovoltaics. this presentation covers the large and increasing number of advanced thermal management materials, including properties and the growing array of applications.

3:15	next generation embedded liquid cooling with ultra low thermal resistance

	michael m. ohadi, ph.d. professor of mechanical engineering and director of advanced thermal management laboratory calce electronics systems and products center department of mechanical engineering, university of maryland

	the demand for increased functionality of electronic products and the simultaneous trend of smaller feature size continue to raise dissipated power and the resulting power densities in electronic systems, introducing new challenges and opportunities in thermal management of modern electronics. successful next generation thermal management systems will have to mitigate thermal limitations on the operation of high performance electronic systems to satisfy the increasing market demand for faster, smaller, lighter, and more energy efficient and cost effective products. the next generation cooling systems will integrate the thermal management techniques into the chip layout, and/or package design, to provide substantially enhanced cooling performance with ultra-low thermal resistance between chip-level heat generation and system-level heat removal path. this presentation will review most recent progress in embedded micro cooling systems, including use of use of thin film micro channel cooling. the technique involves utilization of 3-d structures and a distributed liquid delivery, with dedicated channels for vapor and liquid to maximize phase change heat transfer while facilitating isothermalization of the surface and minimizing the pressure drops and the associated pumping power requirements. record-high heat transfer coefficients have been experimentally demonstrated with heat removal capability in excess of 1 kw/cm2 and heat density of 1 kw/cm3.

4:30	technical presentation (tbd/exhibitor)

5:45	host closing remarks

	thursday program august 30th, 2012
7:30	host introduction and opening remarks

8:00	keynote address
	state of the thermal management market

	alan wong, ph.d. president and c.e.o, aavid thermalloy, llc.

	speaker confirmed/abstract pending

9:15	interoperability p-q curves and cfd confirmation at temperature and airflow

	rick melloy, degree controls, inc.

	this presentation covers the important aspect of computer and telecommunications blade thermal characterization. this is important given the high degree that commercial off the shelf (cots) boards and systems are deployed in applications previously reserved for single vendor solutions. today, shelves and boards in computing and telecommunications systems may be from different vendors, therefore, interoperability is assured by strict adherence to design standards. the shelf is designed to provide certain airflow and pressure characteristics on each board slot. it is the responsibility of the board designer to utilize the available airflow adequately. the prime factor that determines the amount of airflow over a board is its airflow impedance. the board profiler ii (bp ii) is a testing instrument developed for airflow impedance measurement of boards and blades, primarily for atca and µtca. it allows airflow impedance scan of an individual board in a matter of minutes. it provides assurance that a given vendor's board complies with the flow impedance requirements of a given shelf, both of which are likely to be from different suppliers. additionally, the bp ii is designed with a dual function of allowing you to perform functional tests while fully powered and at temperature, within an environmental chamber.

10:00	alfonso ortega, ph.d. james r. birle professor of energy technology associate dean for graduate studies and research director, laboratory for advanced thermal and fluid systems college of engineering, villanova university

	speaker confirmed/topic pending

11:15	thermal management of a 64-bit multicore communications processor: design considerations for air-cooled electronic enclosures

	gary kromann senior staff, mechanical engineer freescale semiconductor

	thermal management is required for the device die-junction temperature control and acceptable reliability. this presentation will discuss the thermal management design considerations for freescale’s next-generation qoriq platforms for moderate forced-air convection of electronic systems. the ic-package thermal conduction paths will be described. the die-junction temperature rise with and without an attached heatsink, for natural to moderate forced-air is presented. the proper thermal control of the die-junction temperature, is primarily dependent upon the system-level design; that is, the component placement, the heat sink, heat sink thermal interface material and airflow. an example of thermal control options for a 1u and 3u electronic enclosures will be presented.

12:30	lunch

1:30	technical presentation on cfd (cd-adapco)

	ruben bons

	speaker confirmed/abstract pending

2:15	using computers to go where experiments cannot: massively-parallel les of turbulent heat transfer

	andrew t. duggleby, ph. d. assistant professor, department of mechanical engineering, texas a&m university

	for decades, the steady increase in modern computing technology has allowed for faster as well as larger, more complex simulations. with all this computing power, there are still only two areas in which a numerical simulation is better than an experimental data: (1) quick, reliable (510-20% error) simulations for design optimization, and (2) massive resolution, highly accurate (< 1% error) simulations. in both cases the computer is going where experiments cannot. in quick simulation case, the simulations are faster and cheaper than any experiment, yielding results (hopefully trustworthy results) fast enough to be included in a design cycle. in the highly-resolved case, the resolution is far beyond any experimental measurements - in the context of turbulent heat transfer, the entire velocity, pressure, and temperature fields are known everywhere at all times. in this talk, the current state-of-the-art for both the quick simulations and the highly- resolved simulations will be discussed in the context of turbulent heat transfer. for the quick simulations, recent advances in not just simulation time, but total cad to analysis time will be discussed: (a) computer-aided design (cad) model to mesh time, (b) simulation time, (c) accuracy vs time trade-os (models, resolution, etc), (d) analysis time. for computational fluid dynamics and heat transfer, this almost always refers to the steady-state reynolds-averaged navier-stokes (rans) models, but an example will be given for a time-dependent large eddy simulation of a venturi nozzle where cad to analysis was done in under 24 hours. for the highly-resolved simulations, analysis techniques to elucidate useful information out of terabytes of data are discussed, with an example of pin-n heat transfer direct numerical simulation (dns) where the modes responsible for heat transfer are extracted via proper orthogonal decomposition (pod), and then enhanced by endwall contouring resulting in increased convection with minimal drag increase.

3:30	technical presentation (tbd/exhibitor)

4:15	state of the art in thermal management - from vacum tube to super computers

	kaveh azar, ph.d. president and c.e.o, advanced thermal solutions, inc.

	thermal management, more than ever before, has become the center of attention in a successful launch of a product. the challenge that we all face as product managers or engineers is to select, design or deploy a successful cooling solution suitable for the product at hand while meeting its market requirements. as the result, we often overlook what is available on the market and what has been developed to meet the cooling challenges of different electronics. the range of cooling options varies from natural convection in air to cryogenic cooling – or any other solution that lies in between. in this presentation, the cooling technologies that have been developed across the electronics market sector – ranging from consumer electronics to high capacity computing to military/avionics equipment, will be presented. the use and reason behind deployment of such cooling technologies along with their salient points will be discussed. the presentation will close with the options to exercise when selecting a cooling system while highlighting the best path for meeting the market requirements of a given electronic system.

5:30	host closing remarks

presentation times subject to change in the event of unforeseen events. in the event of change, updated schedules will be provided at registration.

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