Challenges and Innovations in Avionics and Military Electronics Thermal Management
. by Jim Wilson,
Ph.D.
Avionic and defense electronic systems are continuing to add functionality and features resulting in� thermal design engineers being tasked to devise efficient thermal management approaches with minimum weight, volume, and cost.� While adding the latest high performance devices often increases dissipated heat loads, the ambient environment is still at the mercy of nature.� Difficulties in thermal management cause constraints on system performance, especially in harsh environments.� Continuing research in innovative thermal solutions is easily justified by the need to reduce system operating temperatures.
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Challenges faced by the thermal design community in the avionics and defense industry are mostly familiar to their commercial counterparts.� Designing packaging for the latest high performance semiconductor is similar to the task performed in the commercial sector but complicated by requirements demanded by the avionics and defense electronics sector.� These requirements include harsh environmental temperature extremes, dirty and humid air, and long operating life.�� This presentation will review current thermal design considerations for avionics and defense electronics and describe some of the specific concerns that must be addressed.� The time required for new thermal management technology to be designed into avionics and defense electronics can be extensive.� Some of the reasons why this process is lengthy will be discussed.
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Advances in thermal management for the avionics and defense industry are requiring research at the nano and micro scales. This presentation will cover some current research at these small scales.� The goals of this research are ultimately more efficient thermal packaging as well as the ability to manage high heat flux levels.� Challenges and opportunities for innovative research related to the avionics and defense thermal management field will also be described.