Kaveh Azar

Short Course: Thermal Management of Electronics -Calculations, Measurements, Simulation, Review and Selection of Cooling Options. . by Kaveh Azar, Ph.D.

Topics:

Morning Session – 4 Hrs:

Attendees will be taken from the basic definition of electronics cooling and why thermal management is required; to how to calculate certain parameters; to how to accurately measure them;  and to where and how to use simulation tools like CFD, for effective thermal management. These include:

·         Fundamentals of Electronics Cooling – what it is; why it needs to be considered; how it is approached and what needs to be considered.

·         Required Calculations in Thermal Management – a set of calculations and respective procedures for analytical modeling of components, boards and systems.

·         Effective Characterization – The Role of Measurement in Thermal Management – basic principles of measurement are examined and proper practices for temperature, velocity, pressure and heat flux are reviewed.

·         The Role of Software in Thermal Management—CFD Simulation-  understanding the fundamentals of CFD simulation and reviewing the best practices in modeling electronic components, boards and systems.

Afternoon Session – 5 Hrs:

This session is designed to provide the attendees with features, selection and salient characteristics of different cooling systems.  These include:  selection and design of heat sinks and thermal interface materials, fan selection and characterization, and their role in electronics cooling. The use of vapor chambers and jet impingement for cooling of high power components and boards will also be reviewed. The session ends with an extensive review of cooling solutions that has been developed from vacuum tube to modern high power electronics. These include:

·         Heat Sink Design and Thermal Interface Selection – this topic will feature a review of the process of heat sink design and selection and the role of thermal interface material in cooling of electronic components.

·         Fan Characterization and Its Deployment in Electronic Systems –  this session will involve a review of fan types, their characteristics and best deployment practices. This will include an examination of how fan characterization is done and how to use fan curves for fan selection.

·         Vapor Chamber and Jet Impingement For Thermal Management of High Power Electronics – a review of the design and operations of vapor chambers and how they are deployed in electronics components will be conducted. Also included will be a look at jet impingement characteristics and its heat transfer benefits/shortfalls in tough-to-cool electronics.

·         Review of Salient Features of Market-Developed Cooling Solutions – in this period, an exhaustive review of cooling solutions that have been developed across the electronics industry will be presented. The review starts at the vacuum tube era and continues through to today’s sophisticated electronics. This presentation will encompass all market sectors:   from LEDs and consumer electronics to space and military applications.