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Archived Magazines » June 2006

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Lightweight Titanium Heat Exchangers

Lightweight Titanium Heat Exchangers Lytron, in conjunction with Materials Resources International (MRi), and with SBIR funding, has designed, developed, tested, and proven the manufacturing concepts for a titanium plate fin heat exchanger. It offers similar performance to stainless steel or nickel alloy heat exchangers at 30-50% less weight. details>>
 

Flomerics Technologists’ Paper Selected as Best of 2005 by IEEE Publication

Flomerics Technologists’ Paper Selected as Best of 2005 by IEEE Publication A paper written by two Flomerics executives, Márta Rencz and András Poppe, as well as Ernõ Kollar, Sándor Ress, and Vladimir Székely of the Budapest University of Technology and Economics (BUTE), has been selected as the best of 2005 by the editors of the Institute of Electrical and Electronics Engineers, Inc. (IEEE) Transactions on Components and Packaging Technologies. details>>
 

Imbera Optimizes Thermal Design Using Flotherm Software

Imbera Optimizes Thermal Design Using Flotherm Software Imbera engineers used Flotherm thermal simulation software from Flomerics to optimize early in the design phase the thermal management of a series of Integrated Module Boards (IMBs) that utilize a unique production process. Simulations provided fundamental information about the thermal behavior of the structure, making it possible for several thermal enhancement methods to be evaluated with... details>>
 

Flexible Candlestick Sensor Measures Temperature and Air Velocity

Flexible Candlestick Sensor Measures Temperature and Air Velocity A flexible, robust candlestick-design sensor that measures both temperature and air velocity for characterizing thermal conditions in electronic systems. details>>
 

Slanted Modules Key to Cool Cabinets

Slanted Modules Key to Cool Cabinets To maximize module count while minimizing footprint, Honeywell engineers developing the Experion R300 process control system vertically stacked the I/O and Controller modules. But vertical stacking created an overheating problem. Cool air entering the bottom of the ...... details>>
 

Cooper-Standard Automotives Hydrologic Coolant Tubing

Cooper-Standard Automotives Hydrologic Coolant Tubing Cooper-Standard Automotives’ Global Fluid Systems Division offers HydroLogic™ Fluorinated Ethylene Propylene (FEP) coolant tubing as our specialized product of choice for fluid conveyance in sealed-for-life closed loop electronic cooling systems. details>>
 

Thermal management Summit

Thermal management Summit Our Summit in August of 2005 was a great success. CoolingZone's Business & Technology Summit was designed to mix technology and business issues in a practical fashion and as such it is different from other conferences on thermal management. details>>
 

Characterizing Heat Issues Using Liquid Crystal Thermography

Characterizing Heat Issues Using Liquid Crystal Thermography With their high operating temperatures and crowded packaging conditions, electronic components often face threats from excess heat. Potential problems include part and system malfunctions, shortened component life, and even fire-related issues. To assess a given device?s thermal conditions ...... details>>
 

Performance Curves for Liquid Cooling Loops

Performance Curves for Liquid Cooling Loops There was a mini-symposium held on May 30, in conjunction with ITherm in San Diego. The symposium was well attended even though it was from 7 to 9 PM. The presentations were manly by vendors who were describing their liquid cooling solutions. details>>
 

Anritsu Company Saves 4-6 Week PCB Re-Spin by Thermal Modeling in Early Design Stage

Anritsu Company Saves 4-6 Week PCB Re-Spin by Thermal Modeling in Early Design Stage Anritsu Company has reduced the time required to develop communications test solutions 4 to 6 weeks, eliminating a printed circuit board (PCB) re-spin by modeling thermal management at the board and systems level during the early design process. details>>
 

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