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Archived Magazines » July 2007

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Aircraft Liquid Cooling

Aircraft Liquid Cooling Aircraft engineers today are charged with creating a More Electric Aircraft (MEA) with greater processing capabilities, while also minimizing the aircraft's weight and power consumption. With MEA, hydraulic and pneumatic systems are being replaced with electric systems. Combined with the addition of more high-end embedded computing systems, the need for liquid cooling on jets, helicopters,... details>>
 

Sarantel Selects MicroStripes 3D Electromagnetic Simulation Software in $620,000 R&D Investment

Sarantel Selects MicroStripes 3D Electromagnetic Simulation Software in $620,000 R&D Investment Sarantel Ltd., the leading manufacturer of revolutionary miniature filtering antennas for mobile and wireless devices, has signed a contract worth $620,000 over three years for multiple licenses of Flomerics’ MicroStripes 3D electromagnetic simulation software. details>>
 

Flomerics Releases Flotherm Version 7 with Unrivalled Design Optimization Capability

Flomerics Releases Flotherm Version 7 with Unrivalled Design Optimization Capability Flomerics has released Version 7 of its Flotherm electronics thermal analysis software featuring a new Response Surface Optimization capability that Flomerics believes is unrivalled in computational fluid dynamics (CFD) analysis software. The new Response Surface Optimization fits a 3D surface to the entire design space, enabling engineers to visualize the complete interaction of the design... details>>
 

Lytron Launches Japanese Website

Lytron Launches Japanese Website Lytron recently announced the launch of its new Japanese website. The website, www.Lytron.jp is a partial translation of www.Lytron.com. Alpha Electronics, Lytron's Japanese distributor, assisted in the website localization. Lytron's liquid cooling technologies, including standard and custom cooling systems, cold plates, and heat exchangers are used primarily in power electronics, medical... details>>
 

Thermal Design and Implementation Challenges for Military and Avionics Equipment

Thermal Design and Implementation Challenges for Military and Avionics Equipment Summit 2007, August 22-23, 2007: Thermal design challenges are currently a design constraint on the capability of many military and avionic electronic systems. While several of these challenges are familiar to members of the commercial electronics cooling community details>>
 

A Self-Contained System for Thermal Management of Next Generation Radars and Solid-State Lasers

A Self-Contained System for Thermal Management of Next Generation Radars and Solid-State Lasers Summit 2007, August 22-23, 2007: This lecture will discuss development of a self-contained two-phase flow system suitable for cooling electronics in a wide range of applications. The investigated technology involves use of an innovative, forced-fed evaporation details>>
 

Advances in Thermal Engineering and Management of Microelectronic Devices and Microprocessors

Advances in Thermal Engineering and Management of Microelectronic Devices and Microprocessors Summit 2007, August 22-23, 2007: The trend in increased power densities for integrated systems has been accompanied by the formation of non-uniform heat generation patterns and subsequently sharp temperature gradients across a microprocessor or chip. details>>
 

Thermal Microsystems for Electronics Thermal Management across Multiple Scales

Thermal Microsystems for Electronics Thermal Management across Multiple Scales Summit 2007, August 22-23, 2007: Electro-thermal co-design at the micro- and nano-scales is critical for achieving desired performance and reliability in microelectronic circuits and other microsystems. Emerging thermal microsystems technologies for this application area will be discussed, details>>
 

Recent Advances and Future Challenges in Data Centers

Recent Advances and Future Challenges in Data Centers Summit 2007, August 22-23, 2007: The heat dissipated by electronic equipment continues to increase at an alarming rate. This occurred for products covering a wide range of applications. Manufacturers of this equipment require that the equipment be maintained within an environmental envelope in order to guarantee proper operation. details>>
 

Professor Moffat to Deliver Keynote

Professor Moffat to Deliver Keynote Franklin was wrong - there is at least one other thing that is as certain as death or taxes: we will continue to have problems cooling electrical and electronic systems, and will continue to need innovative solutions to those problems. Here is what I see in my crystal ball for the next ten years. details>>
 

Thermal Characterization, Modeling, and Optimization

Thermal Characterization, Modeling, and Optimization Summit 2007, August 22-23, 2007: Increasing electronic product manufacturing volumes and cooling requirements necessitate the use of new materials and innovative techniques to meet the thermal management challenges and to contribute towards sustainable development in the electronic industry. details>>
 

Free Workshops at Summit 2007

Free Workshops at Summit 2007 If you are attending this year's Business & Technology Summit, do not miss these workshops. You will be able to learn more about new and exciting technologies and will have your questions answered. details>>
 

Flomerics Releases Flovent Version 7 with Unrivalled Design Optimization Capability

Flomerics Releases Flovent Version 7 with Unrivalled Design Optimization Capability Flomerics has released Version 7 of its Flovent computational fluid dynamics (CFD) software for simulating heating and cooling in buildings. Flovent V7 features a new Response Surface Optimization capability that Flomerics believes is unrivalled in CFD analysis software. details>>
 

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