Press Releases

• HP Unveils Architecture for First Net Zero Energy Data Center

  HP Labs architecture significantly reduces data-center power costs and energy requirements details>>

• Vincotech introduce the flyerIPM - P520 for Decentralized Motor Drive Applications

  Decentralized Motor Drive Applications Raise New Requirements regarding the Drive System details>>

• Fujipoly announces the availability of Sarcon� 25GR-T2d

  Fujipoly announces the availability of Sarcon� 25GR-T2d, a very soft highly conformable thermal interface medium that is suited for both low and high-volume production applications. The reinforced .25mm thick TIM also offers engineers a durable and economical solution for tight tolerance die-cut operations. details>>

• Advanced Thermal Solutions, Inc. Launches New Product Line of Brick Heat Sinks for Cooling DC-DC Converters

  Advanced Thermal Solutions, Inc. ("ATS") now provides maxiFLOW� heat sinks specially designed to cool eighth, quarter, half and full brick size DC-DC converters. maxiFLOW� heat sinks reduce air pressure drop and provide greater surface area for more effective convection (air) cooling. details>>

• Microelectronic Design & Measurement Group Formed

  Three companies, Thermal Engineering Associates (TEA), Package Science Services (PSS), and Microsanj, have collaborated to form the Microelectronic Design and Measurement (MD&M) Group. The MD&M Group will better serve customers of the three companies with a broad range of complementary products and services in the very specialized field of semiconductor and systems thermal management. details>>

• Digi-Key Corporation and T-Global Technology Sign Global Distribution Agreement

  Global electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry's largest selection of electronic components available for immediate shipment, and t-Global Technology, a leading supplier of advanced thermal management solutions, today announced the two companies have signed a global distribution agreement. details>>

• Coolcentric Announces Sidecar-- A Passive in Row Heat Exchanger for Rack Densities up to 40kW

  Coolcentric�, a division of Vette Corp, today announced the expansion of its family of data center cooling solutions with the Coolcentric Sidecar Heat Exchanger, a passive in-row cooler that provides extended cooling capacity for increased rack power densities of up to 40kW. Because of its increased cooling performance, warmer water, or free water could be used to dramatically reduce cooling... details>>

• Synthetic Jet Cooling Use for Newest GE LED Light that replaces 100-watt Incandescent

  Ohio-based GE scientists, engineers and product designers worked to leapfrog the competition and go beyond industry expectations for a 75-watt incandescent replacement being introduced first. New 27-watt GE Energy Smart� LED bulb results from collaboration with ecomaginationSM Challenge winner Nuventix, creator of LED cooling technologies for energy-efficient lighting. details>>

• Altair Strengthens Thermal Technology Offering With New HWPA Partner C&R Technologies

  HyperWorks customers can access Sinaps� and SINDA/FLUINT thermal design software through the flexible and cost-effective HyperWorks Partner Alliance details>>

• Wolverine Launches New, Revolutionary IGBT Base Plate Technology: MicroCool�-Cladj�

  Wolverine's MicroCool� Division is proudjj to announce its global License Agreement with Infineon Technologies AG for the djevelopment, manufacture, and sale of its current MDT technology combined with existing cladj metal material to create a new prodjjuct innovation, MicroCool�-Cladj�. details>>