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Press Releases

  • Electronic Interconnect Offers DTE for LEDs

    Direct Thermal Exchange (DTE) design in PCBs intended for LED arrays provides a direct thermal path to the base metal of the assembly, allowing the high-power LEDs to dissipate heat effectively, extending their working life and safety in overall functioning. details>>
  • ASME Names Nominees for its Board of Governors for 2013

    During proceedings of the 2012 ASME Annual Meeting held earlier this month in Montreal, Canada, the Society's Nominating Committee announced three new nominees for the ASME Board of Governors. Stacey Swisher Harnetty of Kingsport, Tenn., Andrew C. Taylor, P.E., of Russellville, Ark., and William M. Worek, Ph.D., of Houghton, Mich. details>>
  • Vincotech's One-Step Mounting Technology - Fast, Reliable, Flexible

    Aiming to cut assembly costs and avert inverter assembly flaws, several companies now offer power modules that can be mounted in a single step. Some use housings with a hole in the middle and a lid to hold the PCB, module and heat sink in place. This certainly facilitates installation and saves time. Vincotech, however, has taken this notion to a whole new level, building on the best of such... details>>
  • Spire Introduces Nano-Ceramic Precision Bearing Fan Series

    Spire today introduced a new fan series uses Nano-ceramic precision bearings for a more silent, reliable and durable cooling fan. Traditional fans with oil seal bearings have serious wear with a relatively short service life as the bearings can easily overheat which results the impeller jamming and the pcb melting. Fans with nano-ceramic bearings are made from namo-zirconia powder as main... details>>
  • Indium Corporation's Heat-Spring� Enhances Green Revolution's CarnotJet(TM) Server Cooling System

    ndium Corporation's Heat-Spring� compressible soft metal thermal interface material is now being used in Green Revolution's CarnotJet(TM) liquid server cooling system. details>>
  • Extruded Aluminum Profiles Offer Cost Savings for Heat Sink Users

    Advanced Thermal Solutions, Inc. now provides nearly 100 economical, high performance aluminum heat sink profiles. They are available in standard lengths, and in economical bulk lengths which can be cut to size, providing cost and time savings. details>>
  • Wall Industries Announces New 5 Watt DC/DC Converters with -5595 C Operating Temperature Range

    5 Watt DC/DC Converters with -55 C to +95 C extended operating temperature range. These converters are best suited for use in military applications, battery operated equipment, measurement equipment, telecom, wireless networks, industry control systems, and anywhere where isolated, tightly regulated voltages and compact size are required. details>>
  • CoolIT Systems Releases Rack Direct Contact Liquid Cooling for HPC Clusters and Data Centers

    CoolIT Systems, the world's leading supplier of reliable and customizable liquid cooling solutions for computers announced today that it has now extended its offering to include solutions for the increasing performance and density challenges that HPC clusters and data centers are facing. Specifically targeting the thermal management issues of today's data centers, CoolIT's Rack Direct Contact... details>>
  • JEDEC Publishes First International Thermal Testing Standards for Light-Emitting Diodes (LEDs)

    JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of a new series of standards for component level testing of high-brightness/power LEDs. details>>
  • New Whitepaper Defines Efficient Cooling Solutions for Data Centers by Asking, 'How Much Containment is Enough?'

    "How Much Containment is Enough?" is a new whitepaper from Chatsworth Products that provides tactics that can help data centers manage the rising cooling costs associated with dense servers and networking equipment, and prepare for sustainability efforts like the impending California Title 24-2013 Energy Code-or best practices as defined by the European Data Center Code of Conduct. details>>
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