Press Releases

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  Advancements in Thermal Management 2013 Conference - June 6-7, Denver. Colorado [Sponsored]

  The Advancements in Thermal Management 2013 Conference will be held June 6-7, 2013 in Denver, Colo. Highlighting the latest advancements in temperature management and thermal mitigation technology, this is a must attend event for all professionals working in this industry and its related fields. details>>
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  International Rectifier Presents Latest Power Management Solutions at PCIM Europe 2013

  IR engineering and sales staff will demonstrate IR's latest energy-saving and high power density enabling technologies and products at the IR booth, Hall 9, Stand 413. The IR booth will feature the company's latest power management solutions including a demonstration of its COOLiR(TM) technology for automotive, uIPM(TM) integrated modules and Gen8 IGBTs for motor control applications, and IR's... details>>
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  Thermal Engineering Associates Lowers The Cost Of Thermal Testing

  Thermal Engineering Associates, Inc. (TEA) announces the availability of a new family of Thermal Interface Material (TIM) characterization tools that offer flexibility, standardization, and low cost. The tools are comprised of the popular TEA Thermal Test Chip (TTC) in sizes ranging from 2.5mm square to 12.8mm square mounted on a variety of popular packages including BGA, QFN, and DIP. This... details>>
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  Colder Products Company Expands FitQuik Product Line with Additional Material Options

  Colder Products Company, a provider of quick disconnect couplings and fittings for plastic tubing, announces the addition of PVDF to the available material options throughout its FitQuik� Connectors product line. This material addition creates more than 100 new FitQuik Connectors alongside the existing nylon, polypropylene and polycarbonate materials and configurations available. details>>
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  Noctua introduces NH-U12S and NH-U14S single tower CPU coolers

  Noctua today presented the latest models of its award-winning NH-U series of quiet single tower CPU coolers: Whereas the NH-U12S comes equipped with the renowned NF-F12 120mm fan and succeeds the highly popular NH-U12P SE2, the NH-U14S is the series' first 140mm model and uses the new NF-A15 140mm fan. Both models feature a new, slim design that ensures easy RAM access and maximum compatibility... details>>
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  NXP Introduces Very Tiny Real-Time Clock Operating at Very Low Voltage

  NXP Semiconductors N.V. today introduced the PCF85063, a new family of very tiny real-time clocks operating at very low voltages down to 0.9 V. With a size of 2 x 3 x 0.75 mm and a pin pitch of 0.5 mm, the PCF85063TP tracks time and date from seconds to years, and is one of the smallest RTCs in the world. details>>
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  Applied Nanotech to Exhibit at Printed Electronics Europe 2013

  Applied Nanotech will present its revolutionary new printed circuit board (PCB) concept that integrates printed electronics with its high thermal conductivity substrate, CarbAl� details>>
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  Gelid Solutions Launches SlimHero CPU Cooler for AMD and Intel CPU's

  The "SlimHero" features 4 sintered power heatpipes with a silent and slim 120mm fan. The copper heatpipes ensure maximum heat transfer from CPU to the aluminum fins. The heatsink is built in a unique shape to lower the air flow resistance. The cooler can be mounted on each directions of the AMD� socket. details>>
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  Reaction Design Enhances Forte CFD Package with Engine Knock Prediction Capabilities

  Reaction Design has added knock prediction capabilities to FORTE, the most advanced CFD package for realistic modeling of fuel effects in internal combustion IC engines details>>
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  Act Heat Pipes Reach 1 Million Hours On-Orbit Milestone

  ACT's Constant Conductance Heat Pipes (CCHPs) have successfully reached over 1 million total hours on-orbit, providing thermal management on-board numerous satellites. details>>