coolingZONE eConference: October 31, 2012

Numerical Analysis of Novel Micro Pin Fin Heat Sink With Variable Fin Density .
by Dr. Satish Kandlikar,

Numerical analyses to characterize and design micro pin fin heat sinks for cooling the 2016s IC chip heat generation are carried out in this paper. A novel design with variable fin density is proposed to generate a more uniform temperature of the IC chip junctions. The variable-density feature allows the gradual increase of the heat transfer area as coolant passes through the system. Single-phase water in the laminar regime is employed. Four different fin shapes (circle, square, elliptical, and flat with two redounded sides) are analyzed. The junction temperature and pressure drop variations in the heat sink generated by these shapes are presented. The effects of varying the fin length and height are also studied. The best heat sink configuration has a thermal resistance ranging from 0.14 to 0.25 K/W with a pressure drop lower than 90 kPa and a junction temperature ~ 314 K under the conditions studied. The temperature gradient at the bottom wall of the heat sink is considered as a parameter for comparing various heat sink designs. The novel cooling device has an overall temperature gradient lower than 2�C/mm, which is significantly lower than the temperature gradients in other schemes reported in literature. read more

LED Experimental Thermal Characterization .
by Norbert Engelberts,

In today\'s electronics industry, there is a constant push to have more functionality in a smaller volume. The dissipated power per function is decreasing, but more and more functions will be put within a smaller volume. Ic\'s, Asics, LEDs are becoming more and more powerful and the thermal load per surface area and volume is increasing. As the result, thermal management of electronics and in particular LED has taken the centre stage for their successful implementation. The presentation will discuss the combination of analytical modelling, computational modelling and experimental testing to help the designer to come up with the most optimal solution and how the final product need to be verify by thermal characterisation and measurements and the challenges involved in doing this. Participants will get an understanding of the methods available to perform accurate thermal characterization and measurement on LED products and understand the need for using experimental testing next to analytical and Computational modeling read more