coolingZONE eConference: December 12, 2012
Speakers
Sense and Nonsense of Correlations
.
by Dr. Clemens Lasance,
Generations of mechanical engineers have been educated to use the correlations that fill the textbooks because: �For convenience of engineering applications, correlation equations are developed over the entire range of dimensions and for any Pr-number�. The presentation will address the question: �How convenient are these correlations in practice?� The answer is that when it comes to thermal management of electronic systems, correlations are not only rather useless (except when you live in a wind tunnel) but also dangerous because designers trust them blindly due to their aura of science. Alternatives will be discussed. read more
System Chassis Materials for Thermal Management: Choices and Tradeoffs
.
by Dr. Carl Zweben,
Are you using the wrong materials for your system chassis design? Traditional thermal materials are at least a decade old and can impose major design limitations on system chassis designs. In response to this critical need, an increasing number of advanced materials are being deployed. Many of these materials hae ultrahigh-thermal-conductivity with thermal conductivity of 400 to 1700 W/m-K, low coefficients of thermal expansion and low densities. In this talk I\'ll exlore these issues and new solutions. read more
Review of emerging cooling options for Next gen Data Centers
.
by Dr. Michael Ohadi,
Investment and growth in data centers is continuing at a rapid pace. In September Canadian Datacenter operator Cogeco Cable announed a $100 million new data center to come on line in 2014. In a recent study, Datacenter Dynamics Intelligence found that worldwide investment in data centers for 2011 will have grown from US$85 billion dollars to $105 billion. Can we cool all these data centers efficiently enough so that their overall benefit is greater than their cost? In my talk we\'ll review and discuss emerging cooling options for data centers. We\'ll consider the tradeoffs and the how-to of such technologies as free air cooling, liquid cooling, dynamic smart-cooling, energy efficiency enhancements in air cooled data centers through cooling advances in metrology read more
Choose category and click GO to search for thermal solutions
Subscribe to Qpedia |
a subscription to qpedia monthly thermal magazine from the media partner advanced thermal solutions, inc. (ats) will give you the most comprehensive and up-to-date source of information about the thermal management of electronics
Submit Article |
if you have a technical article, and would like it to be published on coolingzone
please send your article in word format to [email protected] or upload it here
Subscribe to coolingZONE |
Submit Press Release |
if you have a press release and would like it to be published on coolingzone please upload your pr here
Member Login |
Supplier's Directory |
|
Media Partner, Qpedia |
Heat Transfer Calculators |