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Heat Transfer Calculators

Library

coolingZONE Library – where engineers and researchers go to see the latest and archived developments in thermal management.


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Library  »  PAPERS  »  Analysis

Determining the junction temperature in semi-conductor packages - Part IV

 - Determining the Junction Temperature in semi-conductor Packages by Bruce M. Guenin, Associate Editor, Amkor Technology Technical Data. This is the fourth of a four-part series. Read more »

Natural convection modeling of heat sinks

 - Natural convection modeling of heat sinks by Richard Culham, P. Teertstra, and M.M. Yovanovich from the University of Waterloo. Read more »

Use of thermal analysis information in avionics equipment development

 - Diganta Das, University of Maryland, writes about the Use of thermal analysis information in avionics equipment development. Read more »

Use of junction-to-board thermal resistance in predictive engineering

 - Bennet Joiner of Motorola explains how to Use junction-to-board thermal resistance in predictive engineering. Read more »

Thermal analysis moves into the 21st century

 - Steve Addison, PhD of Flomerics Inc. explains how thermal analysis has moved into the 21st century with CFD and engineering software. Read more »

Safety tips and techniques for FEA in modeling solids

 - Tony Rizzo from Lucent Technologies (Bell Labs) discusses using commercially available FEA software as one component of thermal design. Read more »

Pressure drop coefficients for thin perforated plates

 - This article provides an overview of how to analyze pressure drop coefficients for thin perforated plates. Read more »

One-dimensional heat flow

 - Bruce M. Guenin, Ph.D., Associate Editor, describes the equations needed to analyze temperature difference and thermal resistance in one-dimensional heat flow situations. Read more »

Integrated thermal network models are still useful

 - Vincent P. Manno, Department of Mechanical Engineering, Tufts University, explores the utility of thermal network models to understand the interaction between components. Read more »

Improving productivity in electronic packaging with flow network modeling (fnm)

 - Christian Belady, Hewlett-Packard and Kanchan M. Kelkar and Suhas V. Patankar, Innovative Research, Inc. describes the technique of Flow Networking Modeling (FNM) in CFD analysis. Read more »

How Thermal Conductivity Relates to Electrical Conductivity

 - Clemens J.M. Lasance, Philips Research Laboratories, looks at the Wiedemann-Franz Law, which links thermal conductivity to electrical conductivity. Read more »

Forced convection cooling inside an electronics enclosure

 - G.R. Ahmed, Northern Telecom Ltd.; J.R. Culham, University of Waterloo; and D. Cooper, Northern Telecom Ltd. describes the thermal analysis of forced convection cooling inside an electronics enclosure. Read more »

Fan cooled enclosure analysis using a first order method

 - Gordon N. Ellison from Thermal Computations, Inc. explains how to perform a first-order analysis of a fan-cooled enclosure. Read more »

Determining the junction temperature in semi-conductor packages - Part III

 - Determining the Junction Temperature in semi-conductor Packages by Bruce M. Guenin, Associate Editor, Amkor Technology Technical Data. This is the third of a four-part series. Read more »

Determining the junction temperature in a plastic semiconductor package - part II

 - Determining the Junction Temperature in semi-conductor Packages by Bruce M. Guenin, Associate Editor, Amkor Technology Technical Data. This is the second of a four-part series. Read more »

Determining the junction temperature in a plastic semiconductor package - part I

 - Determining the Junction Temperature in semi-conductor Packages by Bruce M. Guenin, Associate Editor, Amkor Technology Technical Data. This is the first of a four-part series. Read more »

Convection and radiation loss from a fin

 - Bruce M. Guenin, PhD, Associate Editor, explains the analysis of convection and radiation loss from a fin. Read more »

Convection and radiation heat loss from a printed circuit board

 - This article by Bruce Guenin focuses on the mathematical analysis of heat transfer from the surface of a PCB to the ambient. Read more »

Analyzing Convection and Radiation Heat Transfer

 - B. M. Guenin, Associate Editor, Amkor Electronics, explains the heat transfer processes of convection and radiation. Read more »

Conduction heat transfer in a printed circuit board

 - Bruce Guenin explains how to analyze the conductive heat flow across a PCB. Read more »

Calculating spreading resistance in heat sinks

 - Seri Lee, Amkor Electronics, Inc. shows how to calculate the spreading resistance in heat sinks in order to improve thermal performance. Read more »

Calculating interface resistance

 - M. M. Yovanovich, J. R. Culham and P. Teertstra, Microelectronics Heat Transfer Laboratory Department of Mechanical Engineering University of Waterloo demonstrate how to calculate interface resistance. Read more »

Beyond the arrow plot - New methods for flow visualization

 - Jarke J. van Wijk, Eindhoven University of Technology, explains new flow visualization techniques in CFD and how they benefit engineers. Read more »

Applying computational fluid dynamics to heat sink design and selection

 - Catharina R. Biber, Wakefield Engineering Inc., describes how CFD can be used to select or design the proper heat sink for electronics cooling applications. Read more »

Adjusting temperatures for high altitude

 - Jinny Rhee, Rhee Thermosciences and Kaveh Azar, Lucent Technologies, explain how to adjust temperature analysis for higher altitudes. Read more »

A simple method to estimate heat sink air flow bypass

 - Robert E. Simons, Electronics Cooling Applications and Roger R. Schmidt, IBM Corporation, explain how to estimate heat sink air flow bypass. Read more »

A practical formula for air-cooled boards in ventilated enclosures

 - Mario Misale, Dipartimento di Termoenergetica e, Condizionamento Ambientale, University of Genoa, demonstrates a practical formula for the thermal design of ventilated enclosures. Read more »

Topics and Articles in Electronics Cooling