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Press Releases

  • Microfabrica Presents New FINJET Thermal Management Design at SEMI-THERM 33

    Microfabrica, the world leader in Advanced Additive Manufacturing, presented performance results from their novel FINJET thermal management device at the SEMI-THERM. details>>
  • ATS fanSINK with maxiGRIP adds air flow at the device level

    ATS offers a large family of fanSINK products for applications where FPGA or ASICs in BGA packages are deployed. details>>
  • Elenion Technologies Demonstrates Silicon Photonic on-Board Optics

    Elenion Technologies, an innovator in silicon photonic technologies, announced it will demonstrate Optical-Interconnect-Devices (OIDs) for direct-attach fiber-to-the-server and parallel multi-channel on-board modules for switches. details>>
  • Mentor Graphics Receives Harvey Rosten Award for Thermal Heatsink Optimization Methodology

    Mentor Graphics Corporation announced that Dr. Robin Bornoff, Dr. John Parry and John Wilson, a team from Mentor Graphics Mechanical Analysis Division, received the Harvey Rosten Award for Excellence in thermal modeling and analysis of electronics. details>>
  • Bel Power Solutions Announces Next Generation Regulated Bus Converter

    Bel Power Solutions, a Bel group company and premier global manufacturer of power management devices, announces the 0RQB-X0S10BG. details>>
  • Phononic Brings High-Performance Electronics Cooling to Asia Pacific

    Phononic, the company revolutionizing cooling and heating with solid-state technology, announced it is has expanded its global footprint within the Asia Pacific region with the opening of a sales office in Taiwan. details>>
  • Fujipoly offering new form-in-place TIM to fill large gaps

    Fujipoly SARCON SPG-30B is a highly conformable/thermally conductive, high viscosity type silicone compound. details>>
  • MAHLE moves into vehicle electronics with purchase of Nagares

    MAHLE plans to take over Spanish electronics specialist Nagares SA. details>>
  • Ultra-Low Dropout 150mA Regulator from Diodes Inc. Supports Wide Input Voltage Range

    Diodes Incorporated, a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic, analog and mixed-signal semiconductor markets, introduced the AP7380. details>>
  • PSMA Announces APEC 2017 Industry Session on 3D Power Packaging

    The Power Sources Manufacturers Association (PSMA) Packaging Committee is sponsoring an Industry Session at APEC 2017 titled, "Component, Reliability and Manufacturing Innovations for 3D Power Packaging." details>>
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