Press Releases

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  Heat Sink Attachment System Increases Off The Shelf Heat Sink Performance

  Advanced Thermal Solutions, Inc., has introduced clipKIT, the ultimate heat sink attachment system that can be used with most industry standard, off the shelf straight fin, pin fin, cross cut or slant fin heat sinks. The new product raises the bar in thermal, vibration and shock heat sink performance. The clipKIT� line is available exclusively from Digi-Key. details>>
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  Artila Releases RIO-2018 Web Enabled Thermocouple Input Module

  Artila Electronics, the leading designer and manufacturer of embedded device networking and computing, is proud to release RIO-2018, the new generation of web enabled thermocouple input module. RIO-2018 is powered by ARM Cortex M3 and FreeRTOS operating system and features three thermocouple input channels, one 10/100Mbps Ethernet port, two isolated digital input channels and one relay output. details>>
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  Japanese Cooling Expert Scythe Unleashes New Ninja 4 CPU Cooler

  Ninja 4 stays true to the core concept of the Ninja series, by keeping focus on passive and semi-passive cooling capabilities of the tower-cooler. To further underline this core concept, a new fan with additional features has been introduced. The GlideStream 120 PWM fan has equipped with a special fan controller, allowing users to switch between three different fan speed ranges. Low mode has been... details>>
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  MechaTronix Launches 5.000lm LED Cooling in just 20mm Height

  MechaTronix now launches the ModuLED Mega 13420. With a diameter of 134mm and a height as low as 20mm, this LED cooler performs a thermal resistance of 1.32 degrees C/W or the equivalent of 5.000 lumen. details>>
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  SAE International Book Examines the Impact of Thermal Management on Efficiency of Engines in Vehicles

  Thermal Management in Automotive Applications offers insights into how thermal management impacts the efficiency of engines in heavy vehicles, the effects of better coolant flow control, and the use of smart thermostat and next-generation cooling pumps. It also provides an in-depth analysis of the possible gains in optimum warm-up sequence and thermal management on a small gasoline engine. details>>
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  Dow Corning's New Silastic Fluorosilicone Elastomers Extend Thermal Stability, Design Options for Automotive Applications

  Combining its expertise in formulating, mixing and compounding with its ability to modify polymer structure, the company was able to develop a more heat-resistant Silastic FSR technology for extreme high-temperature applications. This new platform now enables Dow Corning's FSR-engineered elastomers to meet the demands of customer automotive applications that require long-lasting, reliable... details>>
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  Fujipoly Highlights Sarcon SPG-30A Ultra Low Compression Thermal Gap Filler

  Sarcon SPG-30A is an easy to handle, high viscosity thermal silicone that is ideal for filing large gaps between delicate circuit board components and a heat sink. Requires minimal compression force. details>>
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  Jaro Launches Low Noise, Fluid Bearing Air Movers for Thermal Management

  Due to a variety of potential mounting options, JARO's frame-less bracket fans offer an amazing level of design flexibility. They are ideal for IC, CPU or embedded heat sink designs, and can also be directly mounted onto circuit boards. The blade diameter ranges in size from 20mm (on the small end) up to 88mm blade diameter (on the large end). Height ranges from 7mm (low profile) to 15mm. Airflow... details>>
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  NASA High Temperature Thermoelectric Material Called Skutterudite Commercialized by Evident Technologies

  NASA's Jet Propulsion Laboratory, Pasadena, California, has licensed patents on high-temperature thermoelectric materials to Evident Technologies, Troy, New York, which provides these kinds of materials and related power systems. Evident Technologies will use technological advances from JPL in this area to develop commercial, high-temperature thermoelectric modules for terrestrial applications. details>>
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  Low Profile Full Brick Baseplate Cooled AC/DC Supplies Need No External Components

  XP Power's ASB110 series provides a complete AC/DC power supply module requiring no external components. The full-brick sized power supplies offer high efficiency and a low profile for PCB pin-mounted designs. Aimed at ITE and industrial customers looking for a base-plate cooled power supply solution, the ASB110 provides 110W of DC output power from a universal AC input. Its high efficiency of... details>>