Press Releases

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  Indium Corp. Features Its Reinforced Indium and Solder Alloy Fabrications [VIDEO]

  InFORMS are patented fabrications in which braided, woven, or random-fiber metal substrate materials are embedded into a solder preform. This technology is ideally suited for IGBT assembly of the DBC to the baseplate. details>>
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  Laird Tech Releases Coolzorb 400 Series- A Thermal Conductive Absorber

  This hybrid materials product provides EMI mitigation while moving heat away from sensitive electronics; Laird has introduced the dual-function, board level material that simultaneously improves signal integrity and temperature stability of electronic circuits. details>>
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  Himalay Engineering Co. Offers Die Cast Aluminum Heat-sinks for Low-cost Cooling [VIDEO]

  Made from high quality raw materials Himalay Engineering Company's custom designing of aluminum heat-sinks increases the efficiency life of devices and are known for their optimum efficiency and performance level. Our products are available in various sizes and are reckoned for their robust construction, high tensile strength and corrosion and abrasion resistance. details>>
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  Versarien Technologies' Launches First Range of 10 Low Profile Air Cooled Heat Sinks

  Versarien plc's subsidiary, Versarien Technologies Limited, has launched a brand new range of 10 low profile air cooled heat sinks using the material VersarienCu. This is the first 'off the shelf' thermal management solution released by Versarien Technologies and offers added performance in low profile applications for passive cooling environments. details>>
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  DHCAE- Tools Releases CastNet V4 with extended functionality for OpenFOAM and a revised GUI

  CastNet is an essential element of DHCAE Tools' modelling environment that supports the complete workflow for CFD and FEA applications from CAD import via mesh generation and case setup, run-time control and monitoring of the simulation job up to final post-processing. details>>
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  Sensirion Introduces The SLS-1500 Compact Liquid Flow Meter

  Delivering measurements for 0-40 ml/min flow rates, SLS-1500 has 20 msec typ response time and can monitor highly dynamic dispensing processes. Modular approach, combining sensor and interface cable, ensures optimal match and accelerated results. Flow channel inside sensor is completely straight and open and has no moving parts, while inert wetted materials provide chemical resistance and... details>>
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  Innovations In Optics, Inc. Sources for Ultrafast Line Scan Applications Deliver Megalux Illuminance with Passive Cooling

  Innovations in Optics, Inc. offers the Aurora Classic LED Line Source Illuminators that offer Megalux illuminance using passive cooling. Other line lights for machine vision require water-cooling to achieve equivalent Megalux levels that the Aurora Classic LED Line Sources can provide while cooling with natural convection. details>>
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  LIA Laboratories Ltd tests Show Nanotherm Thermal Management Substrates Running up to 47c Cooler than Competing Solutions

  Tests by The LIA Laboratories show Cambridge Nanotherm's solution offered best-in-class thermal management solution for LEDs across comparative products tested at the same time. details>>
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  Data Translation Releases The DT9828, A Low-cost USB Thermacouple Measurement

  The DT9828 design sets the accuracy benchmark for thermocouple measurements. Combined with the included QuickDAQ ready-to-measure application software, the DT9828 is a powerful temperature data logger. details>>
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  AI Technology, Inc (AIT) Introduces 3D-TSV Ultra-Thin Wafer Processing Temporary Bonding Adhesive Film

  AIT high temperature capable WPA removes easily with laser assisted and solvent assisted release separation de-bonding besides traditional heat-sliding processes. details>>